基本信息:
- 专利标题： 镀膜装置
- 申请号：CN201711118432.2 申请日：2017-11-13
- 公开(公告)号：CN107675139B 公开(公告)日：2020-02-07
- 发明人： 黄国兴 , 王旭 , 万志
- 申请人： 赫得纳米科技(昆山)有限公司
- 申请人地址： 江苏省苏州市昆山市开发区高科技工业园都市路21号
- 专利权人： 赫得纳米科技(昆山)有限公司
- 当前专利权人： 赫得纳米科技(昆山)有限公司
- 当前专利权人地址： 江苏省苏州市昆山市开发区高科技工业园都市路21号
- 代理机构： 北京超凡志成知识产权代理事务所
- 代理人： 刘锋
- 主分类号： C23C14/50
- IPC分类号： C23C14/50 ; C23C14/10
The invention provides a film plating device and a film plating method, and relates to the technical field of film plating. The film plating device comprises a tool and a support mechanism; the tool covers the inner side wall of a substrate shell needing the film plating, and is detachably connected with the inner side wall; and the tool connected with the substrate shell needing the film platingis hung on the support mechanism for preventing sputtering of film plating materials onto the inner side wall in film plating. The film plating device and the film plating method can effectively prevent the overflow plating of AF film materials to the inner side wall of the shell, and solve the problems of difficult subsequent processes and bad electric conduction caused by the overflow plating; and the film plating device is simple in structure, flexible and reliable.
公开/授权文献:
- CN107675139A 镀膜装置及镀膜方法 公开/授权日：2018-02-09