基本信息:
- 专利标题： 红外线温度传感器、电路基板以及使用红外线温度传感器的装置
- 专利标题（英）：Infrared temperature sensor, circuit board, and device using infrared temperature sensor
- 申请号：CN201680016650.2 申请日：2016-01-21
- 公开(公告)号：CN107407602A 公开(公告)日：2017-11-28
- 发明人： 野尻俊幸 , 布施武士 , 碓井正幸 , 细水亮
- 申请人： 世美特株式会社
- 申请人地址： 日本东京墨田区锦糸1丁目7番7号
- 专利权人： 世美特株式会社
- 当前专利权人： 世美特株式会社
- 当前专利权人地址： 日本东京墨田区锦糸1丁目7番7号
- 代理机构： 北京同立钧成知识产权代理有限公司
- 代理人： 杨贝贝; 臧建明
- 优先权： 2015-063207 2015.03.25 JP
- 国际申请： PCT/JP2016/051663 2016.01.21
- 国际公布： WO2016/152220 JA 2016.09.29
- 进入国家日期： 2017-09-19
- 主分类号： G01J5/02
- IPC分类号： G01J5/02 ; G01J1/02 ; G01J5/04 ; G01J5/10 ; G03G15/20 ; H01L37/02
Provided is a surface-mount infrared temperature sensor that can be miniaturized and that can effectively specify a measurement section of a detection target. A surface-mount infrared temperature sensor 1 that is provided with: a thermally conductive main body 2 that is provided with a light-guiding part 21 that has an opening 21a on one surface side and that is formed so as to guide infrared light and with a shielding part 22 that has a shielding wall 22a on the one surface side and that is formed so as to shield infrared light; a substrate 3 that is provided on the other surface side of the main body 2; an infrared-light-detection heat-sensitive element 4 that is arranged upon the substrate 3 in a position that corresponds to the light-guiding part 21; a temperature-compensation heat-sensitive element 5 that is arranged upon the substrate 3 so as to be separated from the infrared-light-detection heat-sensitive element 4 and that is arranged in a position that corresponds to the shielding part 22; a wiring pattern 31 that is formed upon the substrate 3 and that is connected to the infrared-light-detection heat-sensitive element 4 and the temperature-compensation heat-sensitive element 5; and a mounting terminal 32 that is connected to the wiring pattern 31 and that is formed on an end-part side of the substrate 3.
公开/授权文献:
- CN107407602B 红外线温度传感器、电路基板以及使用所述传感器的装置 公开/授权日：2020-10-23