The invention discloses a CHIP-LED product, and a manufacturing method of the same. The manufacturing method of the CHIP-LED product includes the steps: S1, manufacturing a line layer and a conductive hole on a substrate, wherein the line layer includes a front line layer at the front side of the substrate and a back line layer on the back of the substrate; S2, performing plasma cleaning on the front side of the substrate; S3, fixing an LED chip on the front line layer of the substrate; S4, spraying one layer of solid particles on the front side of the substrate as nanometer level or micron level of adhesive which is thermoplastic solvent adhesive; S5, covering the adhesive layer with packaging adhesive, and packaging the substrate, the front line layer and the LED chip into an integrated semi-finished product; and S6, after solidifying and drying the adhesive layer, using a cutting device to cut the semi-finished product into single CHIP-LEDs. The invention also provides a CHIP-LED product. One side surface, being adjacent to the substrate, of the packaging adhesive, is provided with an adhesive layer formed by nanometer level or micron level solid particles. The manufacturing method of the CHIP-LED product and the CHIP-LED product have better airtightness and moisture resistance.