基本信息:
- 专利标题： 芯片键合装置及方法
- 专利标题（英）：Chip bonding device and method
- 申请号：CN201610113370.5 申请日：2016-02-29
- 公开(公告)号：CN107134427A 公开(公告)日：2017-09-05
- 发明人： 郭耸 , 朱岳彬 , 陈飞彪 , 戈亚萍
- 申请人： 上海微电子装备有限公司
- 申请人地址： 上海市浦东新区张东路1525号
- 专利权人： 上海微电子装备有限公司
- 当前专利权人： 上海微电子装备(集团)股份有限公司
- 当前专利权人地址： 上海市浦东新区张东路1525号
- 代理机构： 上海思微知识产权代理事务所
- 代理人： 屈蘅; 李时云
- 主分类号： H01L21/673
- IPC分类号： H01L21/673 ; H01L21/677 ; H01L21/60 ; H01L21/67
The invention provides a chip bonding device which comprises a first moving table, a second moving table, an absorbing disc, an accurate adjustment and transfer structure, a bonding table and a control system. The invention further provides a chip bonding method, which is characterized in that chips are absorbed one by one through adopting the absorbing disc, then the position of each chip on a carrier plate is accurately adjusted through the accurate adjustment and transfer structure, and the chips on the carrier plate are bonded to a substrate in one time, so that batch bonding of the chips is realized, and the efficiency of a flip chip bonding process is effectively improved. The chip bonding device adopts a mode of chip batch pickup and batch bonding, the time of chip pickup, chip position accurate adjustment and chip bonding is balanced, the bonding device is enabled to improve the yield while ensuring the bonding precision.
公开/授权文献:
- CN107134427B 芯片键合装置及方法 公开/授权日：2020-05-01