基本信息:
- 专利标题： 导电性粘接膜和切割芯片接合膜
- 专利标题（英）：Electrically conductive adhesive film and dicing die bonding film
- 申请号：CN201680003698.X 申请日：2016-04-12
- 公开(公告)号：CN107075317A 公开(公告)日：2017-08-18
- 发明人： 三原尚明 , 切替德之 , 杉山二朗
- 申请人： 古河电气工业株式会社
- 申请人地址： 日本东京都
- 专利权人： 古河电气工业株式会社
- 当前专利权人： 古河电气工业株式会社
- 当前专利权人地址： 日本东京都
- 代理机构： 北京清亦华知识产权代理事务所
- 代理人： 宋融冰
- 优先权： 2015-084094 20150416 JP
- 国际申请： PCT/JP2016/061795 2016.04.12
- 国际公布： WO2016/167245 JA 2016.10.20
- 进入国家日期： 2017-05-17
- 主分类号： C09J7/00
- IPC分类号： C09J7/00 ; C09J7/02 ; C09J9/02 ; C09J11/04 ; C09J163/00 ; C09J179/04 ; C09J201/00 ; H01L21/52
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when joining a semiconductor power element to a metal lead frame, and which is lead free and places little burden on the environment. Specifically, the present invention provides an electrically conductive adhesive film that contains metal particles, a thermosetting resin and a compound having Lewis acid properties or a heat acid generator, wherein the compound having Lewis acid properties or the heat acid generator is characterized by being selected from among boron fluoride or a complex thereof, a protic acid having a pKa value of -0.4 or lower, or a salt or acid obtained by combining the same anion as the salt of the protic acid with a hydrogen ion or other cation. In addition, the present invention provides a dicing and die bonding film obtained by bonding the electrically conductive adhesive film to a pressure-sensitive adhesive tape.
公开/授权文献:
- CN107075317B 导电性粘接膜和切割芯片接合膜 公开/授权日：2020-10-02