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基本信息:
- 专利标题: 一种半导体阀串的压装装置及压装方法
- 专利标题(英):Press mounting apparatus and press mounting method of semiconductor valve string
- 申请号:CN201610684690.6 申请日:2016-08-18
- 公开(公告)号:CN106298594A 公开(公告)日:2017-01-04
- 发明人: 刘恒 , 钟建英 , 吴军辉 , 赵芳帅 , 高树同 , 耿杰 , 袁婷婷 , 邓渊 , 王鹏 , 程铁汉 , 蔚泉清 , 贾娜 , 张培园
- 申请人: 平高集团有限公司 , 北京平高清大科技发展有限公司 , 国家电网公司 , 国网山东省电力公司电力科学研究院
- 申请人地址: 河南省平顶山市南环东路22号
- 专利权人: 平高集团有限公司,北京平高清大科技发展有限公司,国家电网公司,国网山东省电力公司电力科学研究院
- 当前专利权人: 平高集团有限公司,北京平高清大科技发展有限公司,国家电网公司,国网山东省电力公司电力科学研究院
- 当前专利权人地址: 河南省平顶山市南环东路22号
- 代理机构: 郑州睿信知识产权代理有限公司
- 代理人: 徐小磊
- 主分类号: H01L21/67
- IPC分类号: H01L21/67 ; H01L21/68 ; H01L21/683 ; H01L23/36 ; H01L21/50
The invention provides a press mounting apparatus and press mounting method of a semiconductor valve string. The press mounting apparatus comprises a horizontal workbench arranged on a frame, the horizontal workbench is provided with a guiding support mechanism used for guiding and supporting each device in a semiconductor valve string to be press-mounted, a force application mechanism is arranged at the end of a guiding direction on the frame, and the force application direction of the force application mechanism is the same as the guiding direction. The advantages are as follows: each device in the semiconductor valve string is horizontally placed on the guiding support mechanism for assembling, compared to a conventional vertical accumulation placement method, the method reduces transport paths, and therefore, the labor intensity is low and the assembling efficiency is high. Besides, the semiconductor valve string does not have to be hoisted and moved after being assembled, pressure loading can be carried out directly by use of the force application mechanism, the press-mounting efficiency and the automation degree of the whole press-mounting operation are improved, and the press-mounting precision is effectively guaranteed. At the same time, the height of the horizontally arranged semiconductor valve string is greatly reduced, and the press-mounting stability of the semiconductor valve string is improved.
公开/授权文献:
- CN106298594B 一种半导体阀串的压装装置及压装方法 公开/授权日:2019-01-22
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置;专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |