![一种薄带导体的低电阻焊接装置](/CN/2016/1/22/images/201610112901.jpg)
基本信息:
- 专利标题: 一种薄带导体的低电阻焊接装置
- 专利标题(英):Low-resistance welding apparatus for thin-strip conductor
- 申请号:CN201610112901.9 申请日:2016-03-01
- 公开(公告)号:CN105633759A 公开(公告)日:2016-06-01
- 发明人: 马光同 , 张涵 , 杨晨 , 李兴田 , 龚天勇 , 刘坤
- 申请人: 西南交通大学
- 申请人地址: 四川省成都市二环路北一段111号西南交通大学科技处
- 专利权人: 西南交通大学
- 当前专利权人: 西南交通大学
- 当前专利权人地址: 四川省成都市二环路北一段111号西南交通大学科技处
- 代理机构: 成都信博专利代理有限责任公司
- 代理人: 张澎
- 主分类号: H01R43/02
- IPC分类号: H01R43/02 ; H01R4/68
The invention discloses a low-resistance welding apparatus for a thin-strip conductor. The low-resistance welding apparatus comprises a heating table, a pressure table, a controller and an upper computer, wherein the controller and the upper computer are used for monitoring and controlling the welding temperature of the heating table and the applying pressure of the pressure table in real time, programming and setting an automatic welding program, and performing accurate welding and control; the heating table and the pressure table are used for providing high temperatures for melting a soldering flux and providing pressure for realizing uniform distribution of the soldering flux respectively; the heating table is an automatically-controlled electronic heating apparatus, and heats the pressure table through conduction; the pressure table mainly comprises the five parts of a driving motor, a guiding rod, a bracket, an upper pressing block and a lower pressing block; a welding sample is put between the upper pressing block and the lower pressing block; after the upper pressing block is laminated to the lower pressing block, the sample is compressed tightly; the laminated surface of the upper pressing block and the lower pressing block is machined precisely, and the depth of parallelism and perpendicularity of the surface are less than 5[mu]m/100mm.
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01R | 导电连接;一组相互绝缘的电连接元件的结构组合;连接装置;集电器 |
------H01R43/00 | 专用于制造、组装、维护或修理线路连接器或集电器的设备或方法,或专用于连接电导体的设备或方法 |
--------H01R43/02 | .用于焊接或熔接连接 |