
基本信息:
- 专利标题: 基于纳秒‑皮秒‑飞秒激光复合技术的平板式氧传感器制备方法
- 申请号:CN201510356450.9 申请日:2015-06-25
- 公开(公告)号:CN104959600B 公开(公告)日:2017-05-10
- 发明人: 刘胜 , 曹祥东 , 付兴铭 , 刘亦杰 , 郑怀 , 杨军 , 曹钢 , 吴登峰
- 申请人: 武汉大学 , 武汉飞恩微电子有限公司 , 武汉虹拓新技术有限责任公司
- 申请人地址: 湖北省武汉市武昌区珞珈山武汉大学; ;
- 专利权人: 武汉大学,武汉飞恩微电子有限公司,武汉虹拓新技术有限责任公司
- 当前专利权人: 武汉大学,武汉飞恩微电子有限公司,武汉虹拓新技术有限责任公司
- 当前专利权人地址: 湖北省武汉市武昌区珞珈山武汉大学; ;
- 代理机构: 武汉科皓知识产权代理事务所
- 代理人: 胡艳
- 主分类号: B22F3/105
- IPC分类号: B22F3/105 ; G01N27/00
The invention discloses a preparation method for a planar-type oxygen sensor based on a femtosecond laser composite technology. The preparation method comprises the steps that firstly, nanosecond, picoseconds or femtosecond laser are selected as original laser to conduct scan, sinter and melt according to the accuracy requirement of each layer of the oxygen sensor, and then picoseconds or femtosecond laser are selected to conduct finish machining on specific areas according to real-time monitoring feedback. According to the actual requirement of the oxygen sensor, the real-time monitoring can be size detection, crystal structure detection, surface appearance detection, composition detection and the like. According to the preparation method for the planar-type oxygen sensor based on the femtosecond laser composite technology, more precise size control and resistance value control can be achieved, the technology is simpler, following resistance repairing is not needed, the precision can be reached without compensation, the processes like clearing and polishing needed when the normal 3D printing is finished are left out, and the problems that the powder is blown, the residual stress is high, and the strength is low are solved; at the same time, excellent uniformity is achieved.
公开/授权文献:
- CN104959600A 基于飞秒激光复合技术的平板式氧传感器制备方法 公开/授权日:2015-10-07
IPC结构图谱:
B | 作业;运输 |
--B22 | 铸造;粉末冶金 |
----B22F | 金属粉末的加工;由金属粉末制造制品;金属粉末的制造 |
------B22F3/00 | 由金属粉末制造工件或制品,其特点为用压实或烧结的方法;所用的专用设备 |
--------B22F3/02 | .仅压实 |
----------B22F3/105 | ..利用电流、激光辐射或等离子体 |