![倒装高压发光器件及其制作方法](/CN/2014/1/147/images/201410735775.jpg)
基本信息:
- 专利标题: 倒装高压发光器件及其制作方法
- 专利标题(英):Inverted high voltage light emitting device and making method thereof
- 申请号:CN201410735775.3 申请日:2014-12-08
- 公开(公告)号:CN104409466A 公开(公告)日:2015-03-11
- 发明人: 钟志白 , 江彦志 , 方秋艳 , 李佳恩 , 徐宸科
- 申请人: 厦门市三安光电科技有限公司
- 申请人地址: 福建省厦门市思明区吕岭路1721-1725号
- 专利权人: 厦门市三安光电科技有限公司
- 当前专利权人: 泉州三安半导体科技有限公司
- 当前专利权人地址: 362343 福建省泉州市南安市石井镇院前村
- 主分类号: H01L27/15
- IPC分类号: H01L27/15 ; H01L33/62 ; H01L33/50 ; H01L33/00
The invention discloses an inverted high voltage light emitting device and a making method thereof. The device comprises a light emitting module, a light conversion layer, an insulating layer, a first support electrode and a second support electrode, wherein the light emitting module comprises a plurality of inverted light emitting units connected in series with one another, the light emitting module is provided with a first surface and a second surface which are opposite, clearances are arranged among all the inverted light emitting units, and each light emitting unit comprises an n-type semiconductor layer, a light emitting layer and a p-type semiconductor layer; the light conversion layer is formed on the first surface of the light emitting module and covers the side surface of each light emitting unit; the insulating layer is formed on the second surface of the light emitting module, covers the second surface of the whole light emitting module, and only exposes the n-type semiconductor layer of the first light emitting unit of the light emitting module and the p-type semiconductor layer of the last light emitting unit; the first and second support electrodes are formed on the insulating layer and electrically isolated from each other, the first support electrode is electrically connected with the n-type semiconductor layer of the first light emitting unit of the light emitting module, and the second support electrode is electrically connected with the p-type semiconductor layer of the last light emitting unit of the light emitting module.
公开/授权文献:
- CN104409466B 倒装高压发光器件及其制作方法 公开/授权日:2017-08-18
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L27/00 | 由在一个共用衬底内或其上形成的多个半导体或其他固态组件组成的器件 |
--------H01L27/15 | .包括专门适用于光发射并且包括至少有一个电位跃变势垒或者表面势垒的半导体组件 |