
基本信息:
- 专利标题: 一种树脂基防水板及其制造方法
- 专利标题(英):Resin-based waterproof plate and manufacturing method thereof
- 申请号:CN201410319215.X 申请日:2014-07-07
- 公开(公告)号:CN104124013A 公开(公告)日:2014-10-29
- 发明人: 陈宇 , 刘春田 , 张俊 , 王潇潇 , 沙莎 , 罗玲 , 常向阳 , 张军 , 张乐军
- 申请人: 国家电网公司 , 国网辽宁省电力有限公司葫芦岛供电公司 , 绥中嘉木科技有限公司
- 申请人地址: 北京市东城区建国门内大街28号民生金融中心C座1620号
- 专利权人: 国家电网公司,国网辽宁省电力有限公司葫芦岛供电公司,绥中嘉木科技有限公司
- 当前专利权人: 国家电网公司,国网辽宁省电力有限公司葫芦岛供电公司,绥中嘉木科技有限公司
- 当前专利权人地址: 北京市东城区建国门内大街28号民生金融中心C座1620号
- 代理机构: 葫芦岛天开专利商标代理事务所
- 代理人: 魏勇
- 主分类号: H01B17/56
- IPC分类号: H01B17/56 ; H01B17/66 ; H01B13/00 ; E04B1/66 ; E04D13/16
The invention provides a resin-based waterproof plate and a manufacturing method thereof. Plate peaks are formed on the waterproof plate at certain intervals, V-shaped plate grooves are formed among the plate peaks, lower planar segments and lower indent segments are formed alternatively at certain intervals below the waterproof plate, and hollow cavities are formed between the upper side of the waterproof plate and the lower side of the waterproof plate; the waterproof plate and a connecting waterproof plate are connected in a buckling way through buckling plates and mounting screws, upper cambered surfaces are formed on the buckling plates, mounting screw holes are formed in the upper cambered surfaces, lower inserting tips are arranged below the buckling plates, lower slots are formed between every two adjacent lower inserting tips, and hollow cavities are formed between the lower inserting tips and the upper cambered surfaces. The manufacturing method is implemented through resin-based raw material burdening, waterproof plate drawing, extruding and forming, field assembly and a construction process. The resin-based waterproof plate has the characteristics of corrosion prevention, waterproofness, high intensity, high structural property, realization of mechanical production and easiness in construction, and is suitable to be applied in the production and construction of waterproof plates in the fields of electric power and buildings.
公开/授权文献:
- CN104124013B 一种树脂基防水板的制造方法 公开/授权日:2016-08-24
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01B | 电缆;导体;绝缘体;导电、绝缘或介电材料的选择 |
------H01B17/00 | 按形状特点区分的绝缘子或绝缘物体 |
--------H01B17/56 | .绝缘物体 |