![具有近表面冷却微通道的构件及用于提供这种构件的方法](/CN/2013/1/140/images/201310701001.jpg)
基本信息:
- 专利标题: 具有近表面冷却微通道的构件及用于提供这种构件的方法
- 专利标题(英):Component with near-surface cooling microchannel and method for providing the same
- 申请号:CN201310701001.4 申请日:2013-12-19
- 公开(公告)号:CN103878374A 公开(公告)日:2014-06-25
- 发明人: D.E.施克 , S.C.科蒂林加姆 , B.P.莱西 , J.W.小哈里斯
- 申请人: 通用电气公司
- 申请人地址: 美国纽约州
- 专利权人: 通用电气公司
- 当前专利权人: 通用电气技术有限公司
- 当前专利权人地址: 瑞士巴登
- 代理机构: 中国专利代理(香港)有限公司
- 代理人: 肖日松; 谭祐祥
- 优先权: 13/719,772 2012.12.19 US
- 主分类号: B22F7/06
- IPC分类号: B22F7/06
The invention relates to a component with a near-surface cooling microchannel and a method for providing the same. Particularly, a method for providing a near-surface cooling microchannel in a component includes forming a near-surface cooling microchannel in a first surface of a pre-sintered preform, disposing the first surface of the pre-sintered preform onto an outer surface of the base article such that an opening of the outer surface of the base article is aligned with the near-surface cooling microchannel in the first surface of the pre-sintered preform, and, heating the pre-sintered preform to bond it to the base article, wherein the opening of the outer surface of the base article remains aligned with the near-surface cooling microchannel in the first surface of the pre-sintered preform.
公开/授权文献:
- CN103878374B 具有近表面冷却微通道的构件及用于提供这种构件的方法 公开/授权日:2018-01-26
IPC结构图谱:
B | 作业;运输 |
--B22 | 铸造;粉末冶金 |
----B22F | 金属粉末的加工;由金属粉末制造制品;金属粉末的制造 |
------B22F7/00 | 通过对金属粉末进行烧结,以压实或不压实来制造包含此粉末的复合层、工件或制品 |
--------B22F7/06 | .由几部分组成的复合工件或制品,如组成镶片刀具 |