基本信息:
- 专利标题： 晶片封装体及其形成方法
- 专利标题（英）：Chip package and method for forming the same
- 申请号：CN201210265315.X 申请日：2012-07-27
- 公开(公告)号：CN102903763A 公开(公告)日：2013-01-30
- 发明人： 许传进 , 林柏伸 , 张义民 , 杨蕙菁 , 赖炯霖
- 申请人： 精材科技股份有限公司
- 申请人地址： 中国台湾桃园县中坜市中坜工业区吉林路23号9F
- 专利权人： 精材科技股份有限公司
- 当前专利权人： 精材科技股份有限公司
- 当前专利权人地址： 中国台湾桃园县中坜市中坜工业区吉林路23号9F
- 代理机构： 北京林达刘知识产权代理事务所
- 代理人： 刘新宇
- 优先权： 61/513,487 2011.07.29 US
- 主分类号： H01L31/0216
- IPC分类号： H01L31/0216 ; H01L27/146 ; H01L33/44 ; H01L23/552
The invention provides chip package and a method for forming the same. An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a first light shielding layer disposed on the second surface of the substrate; and a second light shielding layer disposed on the first light shielding layer and directly contacting with the first light shielding layer, wherein a contact interface is between the first light shielding layer and the second light shielding layer.
公开/授权文献:
- CN102903763B 晶片封装体及其形成方法 公开/授权日：2016-05-04