基本信息:
- 专利标题： 电磁耦合构造、多层传送线路板、电磁耦合构造的制造方法、及多层传送线路板的制造方法
- 专利标题（英）：Inductive coupling structure, multi-layer transmission-line plate, method of manufacturing inductive coupling structure, and method of manufacturing multi-layer transmission-line plate
- 申请号：CN201180012638.1 申请日：2011-03-03
- 公开(公告)号：CN102783259A 公开(公告)日：2012-11-14
- 发明人： 水岛悦男 , 近藤裕介 , 水野康之 , 渡边靖
- 申请人： 日立化成工业株式会社
- 申请人地址： 日本东京
- 专利权人： 日立化成工业株式会社
- 当前专利权人： 日立化成株式会社
- 当前专利权人地址： 日本东京
- 代理机构： 永新专利商标代理有限公司
- 代理人： 徐殿军
- 优先权： 2010-051986 2010.03.09 JP; 2011-022964 2011.02.04 JP
- 国际申请： PCT/JP2011/054946 2011.03.03
- 国际公布： WO2011/111605 JA 2011.09.15
- 进入国家日期： 2012-09-05
- 主分类号： H05K3/46
- IPC分类号： H05K3/46 ; H01P1/04 ; H01P5/107
Disclosed is an inductive coupling structure to be used in a microwave frequency band, and which is provided with: a laminate that is laminated by having an inner dielectric layer (23) sandwiched in between inner conductive layers (12, 15) that will become a plurality of ground layers; a pair of outer dielectric layers (21, 25) that are opposed to each other with the laminate sandwiched therebetween; and a pair of outer conductive layers (11, 16) that are opposed to each other with the pair of outer dielectric layers (21, 25) sandwiched therebetween. A hole (S) that penetrates the inner dielectric layer (23) and the inner conductive layers (12, 15) that will become a plurality of ground layers is formed on the laminate, and the pair of outer conductive layers (11, 16) are inductively coupled, by making the inner conductive layers (12, 15) that will become a plurality of ground layers electrically connected via a tubular metal film (3) formed on the inner wall of the hole (S).
公开/授权文献:
- CN102783259B 电磁耦合构造、多层传送线路板、电磁耦合构造的制造方法、及多层传送线路板的制造方法 公开/授权日：2016-08-17
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/46 | .多层电路的制造 |