![散热装置](/CN/2011/1/21/images/201110107912.jpg)
基本信息:
- 专利标题: 散热装置
- 专利标题(英):Heat-dissipation device
- 申请号:CN201110107912.5 申请日:2011-04-28
- 公开(公告)号:CN102760706A 公开(公告)日:2012-10-31
- 发明人: 彭学文 , 李伟 , 秦际云 , 刘豪侠
- 申请人: 富准精密工业(深圳)有限公司 , 鸿准精密工业股份有限公司
- 申请人地址: 广东省深圳市宝安区龙华镇油松第十工业区东环二路2号
- 专利权人: 富准精密工业(深圳)有限公司,鸿准精密工业股份有限公司
- 当前专利权人: 全亿大科技(佛山)有限公司
- 当前专利权人地址: 广东省深圳市宝安区龙华镇油松第十工业区东环二路2号
- 主分类号: H01L23/40
- IPC分类号: H01L23/40 ; H01L23/427
A heat-dissipation device comprises a heat-dissipation base, a plurality of fins fixed on the heat-dissipation base, and a plurality of fixing pieces arranged on the heat-dissipation base in a penetrating manner, wherein the heat-dissipation base comprises a bottom plate, a top plate and a plurality of heat pipes interlaid between the top plate and the bottom plate; the heat-dissipation base also comprises a frame body interlaid between the bottom plate and the top plate and surrounding the heat pipes; the frame body comprises a plurality of frame strips that are in end-to-end connection with each other sequentially; a containing space is defined by the frame strips, the bottom plate and the top plate to contain the heat pipes; each of the fixing pieces penetrates through the bottom plate, the frame strips of the frame body and the top plate. As the frame body is connected with the peripheries of the bottom plate and the top plate, the heat-dissipation device avoids the deformation of the bottom plate and the top plate due to the fact that the bottom plate and the top plate are relatively thin and have a difficulty in bearing lock forces of the fixing pieces, the strength of the heat-dissipation device is effectively improved, and the heat pipes are well protected.
公开/授权文献:
- CN102760706B 散热装置 公开/授权日:2015-04-29
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L23/00 | 半导体或其他固态器件的零部件 |
--------H01L23/34 | .冷却装置;加热装置;通风装置或温度补偿装置 |
----------H01L23/40 | ..用于可拆卸冷却或加热装置的安装或固定装置 |