基本信息:
- 专利标题： 具有凹部的半导体结构及其制造方法
- 专利标题（英）：Semiconductor structure having concave part and manufacturing thereof
- 申请号：CN201110203809.0 申请日：2011-07-11
- 公开(公告)号：CN102244069A 公开(公告)日：2011-11-16
- 发明人： 钟启生 , 尹政文
- 申请人： 日月光半导体制造股份有限公司
- 申请人地址： 中国台湾高雄市楠梓加工出口区经三路26号
- 专利权人： 日月光半导体制造股份有限公司
- 当前专利权人： 日月光半导体制造股份有限公司
- 当前专利权人地址： 中国台湾高雄市楠梓加工出口区经三路26号
- 代理机构： 上海专利商标事务所有限公司
- 代理人： 陆勍
- 优先权： 100120608 2011.06.13 TW
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L21/48
The invention provides a semiconductor structure having a concave part and a manufacturing method thereof. The semiconductor structure comprises a substrate, an electrical assembly, a packaging body, and an electromagnetic interference screening assembly. The substrate comprises a concave part, an upper surface, a bottom, a lower surface, a side surface and a grounding part. The lower surface of the substrate is located between the upper surface and the bottom. The concave part of the substrate extends from the lower surface of the substrate to the bottom. The side surface of the substrate extends between the upper surface and the lower surface. The electrical assembly is equipped adjacent to the upper surface of the substrate. The packaging body covers the electrical assembly. The electromagnetic interference screening assembly covers the packaging body, the grounding part and the side surface of the substrate.
公开/授权文献:
- CN102244069B 具有凹部的半导体结构及其制造方法 公开/授权日：2013-10-09
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/552 | .防辐射保护装置，例如光 |