![环氧封端-含邻苯二甲腈侧基聚芳醚树脂、固化物及其制备方法](/CN/2010/1/59/images/201010297920.jpg)
基本信息:
- 专利标题: 环氧封端-含邻苯二甲腈侧基聚芳醚树脂、固化物及其制备方法
- 专利标题(英):Epoxy terminated polyarylether resins with phthalonitrile side group and curing materials and preparation methods thereof
- 申请号:CN201010297920.6 申请日:2010-09-30
- 公开(公告)号:CN101955586A 公开(公告)日:2011-01-26
- 发明人: 喻桂朋 , 潘春跃 , 武绍飞 , 李荣
- 申请人: 中南大学
- 申请人地址: 湖南省长沙市岳麓区麓山南路932号
- 专利权人: 中南大学
- 当前专利权人: 中南大学
- 当前专利权人地址: 湖南省长沙市岳麓区麓山南路932号
- 代理机构: 长沙市融智专利事务所
- 代理人: 颜勇
- 主分类号: C08G65/48
- IPC分类号: C08G65/48 ; C08G65/40 ; C08L71/12 ; C08K5/18 ; C08J3/24 ; C09D171/12 ; C09J171/12
The invention belongs to the field of synthesis of high polymer materials and in particular relates to epoxy terminated polyarylether resins with phthalonitrile side group and curing materials and preparation methods thereof. The preparation method of the epoxy terminated polyarylether resins with phthalonitrile side group is characterized by taking 4-(3,5-dihydroxy phenoxy)-phthalonitrile or derivatives thereof and commercial aromatic di-halogen compounds as polycondensation monomers and simultaneously adding other aromatic bisphenol monomers to carry out nucleophilic substitution reaction and then taking 3-chloro-1,2-epoxypropane as a terminator, thus preparing a series of epoxy terminated polyarylether resins with phthalonitrile side group. The method is simple in steps and convenient and feasible. The polyarylether resins show better dissolubility in the common polar solvents, can be processed in various forms and have good adhesive properties and higher curing reaction activities. The resins are precured at 0-200 DEG C in the presence of aromatic diamines and the like and then are heated to 250-350 DEG C to undergo heat treatment, thus obtaining the resin curing materials with stable dimensions, excellent heat resistance and high strength. The epoxy terminated polyarylether resins with phthalonitrile side group are used in such fields as high-temperature resistant coatings, paints, adhesives, thin films, composites and the like and have extensive application prospect.
公开/授权文献:
- CN101955586B 环氧封端-含邻苯二甲腈侧基聚芳醚树脂、固化物及其制备方法 公开/授权日:2012-04-25
IPC结构图谱:
C | 化学;冶金 |
--C08 | 有机高分子化合物;其制备或化学加工;以其为基料的组合物 |
----C08G | 用碳—碳不饱和键以外的反应得到的高分子化合物 |
------C08G65/00 | 由在高分子主链中形成醚键的反应得到的高分子化合物 |
--------C08G65/02 | .由环醚用杂环开环的反应 |
----------C08G65/48 | ..由化学后处理改性的聚合物 |