The invention provides a semiconductor device which can contribute to downsizing of a module substrate with respect to interconnection between electrode pads which may be directly connected with one another from a function viewpoint. In the semiconductor device, a first semiconductor chip and a second semiconductor chip are stacked and are mounted on a module substrate with their center positionslaterally being deviated with respect to the module substrate. Electrode pads on the first semiconductor chip, and electrode pads on the semiconductor chip which correspond to one another, are directly connected with one another through wires where the distance is short between the end edges of the deviated semiconductor chips and the end edge of the module substrate. Electrode pads on the first semiconductor chip and electrode pads on the semiconductor chip are directly connected with corresponding bonding leads on the module substrate through wires, where the distance is long between the end edge of the deviated semiconductor chips and the end edge of the module substrate.