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    • 1. 发明申请
    • COMPOSITIONS AND METHODS FOR THERMOSETTING MOLECULES IN ORGANIC COMPOSITIONS
    • 用于热分解有机组合物的组合物和方法
    • WO02008308A1
    • 2002-01-31
    • PCT/US2001/022204
    • 2001-07-13
    • C08F38/00C08G61/02C08G61/12H01L21/312C08G14/04C08G63/78C08G63/87C08G73/24
    • C08G61/12C08G61/02C08G2650/60
    • In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.
    • 在制备低介电常数聚合物的方法中,提供了一种热固性单体,其中该热固性单体具有笼形化合物或芳基核心结构,以及共价结合笼形化合物或核心结构的多个臂。 在随后的步骤中,将热固性单体引入聚合物中以形成低介电常数聚合物,其中掺入聚合物中包含位于至少一个臂中的三键的化学反应。 考虑的笼状化合物和核心结构包括金刚烷,二金刚烷,硅,苯基和亚噻吩基,而优选的臂包括亚芳基,支链亚芳基和亚芳基醚。 热固性单体可以有利地用于在电子器件中产生低k介电材料,并且聚合物的介电常数可以通过改变臂的整个长度来控制。
    • 2. 发明申请
    • PROCESS FOR PRODUCING MODIFIED PHENOLIC RESIN
    • 生产改性酚醛树脂的方法
    • WO00034349A1
    • 2000-06-15
    • PCT/JP1999/005450
    • 1999-10-04
    • C08G8/28C08G10/04C08G14/04C08G59/62C08L63/00C08G16/04
    • C08G59/621C08G8/28C08G10/04C08G14/04C08L63/00C08L61/04
    • A process for producing a modified phenolic resin which comprises heating and stirring a heavy oil or pitch together with a formaldehyde compound and a phenol represented by the formula (I) (wherein R is a C2-10, linear or branched, unsaturated hydrocarbon group having one or two unsaturated bonds; p is 1 or 2; X is C1-5 alkyl; and q is 0 or 1) in the presence of an acid catalyst to conduct polycondensation, the amounts of the formaldehyde compound and the phenol being 0.3 to 25 mol in terms of formaldehyde amount and 0.5 to 50 mol, respectively, per mol of the heavy oil or pitch. The modified phenol obtained by the process has flowability around room temperature because it has a far lower melting point than conventional modified phenolic resins obtained from a heavy oil or pitch. It further has a low melt viscosity and hence excellent moldability. When used in combination with an epoxy resin, the modified phenol can give a molded article excellent not only in heat resistance, moisture resistance, corrosion resistance, adhesion, etc. but also in dimensional stability and mechanical properties including strength.
    • 一种改性酚醛树脂的制造方法,其特征在于,将重油或沥青与甲醛化合物和式(I)表示的苯酚(其中R 1为C2-10,直链或支链,不饱和的) 具有一个或两个不饱和键的烃基; p为1或2; X为C 1-5烷基; q为0或1)在酸催化剂存在下进行缩聚,甲醛化合物和苯酚的量为 相对于每摩尔重油或沥青,甲醛量分别为0.3〜25摩尔和0.5〜50摩尔。 通过该方法获得的改性苯酚在室温下具有流动性,因为它具有比从重油或沥青得到的常规改性酚醛树脂低得多的熔点。 它还具有低熔体粘度,因此具有优异的成型性。 当与环氧树脂组合使用时,改性酚可以得到不仅在耐热性,耐湿性,耐腐蚀性,粘附性等方面优异的成型品,而且还具有包括强度在内的尺寸稳定性和机械性能。
    • 3. 发明申请
    • PHENOL-NOVOLACS WITH IMPROVED OPTICAL PROPERTIES
    • 具有改进的光学性质的酚醛树脂
    • WO00017243A1
    • 2000-03-30
    • PCT/US1999/004799
    • 1999-03-05
    • C08G8/00C08G8/04C08G14/04C08G14/12C08G59/08C08G59/62C08L61/06C08L61/10C08L61/14C08L63/00H05K1/02H05K1/03H05K3/28C08F6/10C08F8/00C08G6/00C08G8/06C08G8/12
    • C08L61/06C08G8/04C08G14/04C08G14/12C08G59/08C08L61/14C08L63/00H05K1/0266H05K1/0269H05K1/0326H05K1/0373H05K3/285C08L2666/22C08L61/04
    • The specification discloses a method for the manufacture of a fluorescent polyphenolic product with high UV absorbance, its subsequent epoxidation as well as polyphenolic products and epoxidized derivatives and compositions thereof. The polyphenolic products are prepared by heating glyoxal at a temperature of about 80 DEG C to about 100 DEG C with a molar excess of a phenol in the presence of an acidic catalyst which is eliminated from the reaction mixture at a temperature about 170 DEG C. The total mole ratio of glyoxal to phenol charged to the reaction mixture is about 0.15 to 0.22 moles of glyoxal for each mole of phenol. The glyoxal is added continuously or by stepwise additions to the phenol so as to keep the aldehyde units in the reaction mixture to less than about 70% of the aldehyde units in the total quantity of glyoxal to be charged for making the polyphenol. Water is distilled stepwise or continuously from the reaction mixture. The catalyst is removed from the reaction mixture by further distilling the reaction mixture, generally at higher temperatures.
    • 该说明书公开了一种用于制造具有高UV吸光度的荧光多酚产物,其随后的环氧化以及多酚产物和环氧化衍生物及其组合物的方法。 在约80℃至约100℃的温度下,用摩尔过量的苯酚在酸性催化剂存在下,在约170℃的温度下从反应混合物中除去多酚产物。 对于每摩尔苯酚,加入反应混合物中乙二醛与苯酚的总摩尔比为约0.15至0.22摩尔乙二醛。 连续加入乙二醛或通过逐步添加到苯酚中,以便使反应混合物中的醛单元保持在少量约70%的醛单元中,用于制备多酚的乙二醛总量。 从反应混合物中逐步或连续蒸馏水。 通常在较高温度下进一步蒸馏反应混合物,从反应混合物中除去催化剂。
    • 7. 发明申请
    • PHENOL POLYMER, PRODUCTION METHOD THEREOF AND USE THEREOF
    • 酚醛聚合物,其生产方法及其用途
    • WO2007043684A9
    • 2007-06-07
    • PCT/JP2006320581
    • 2006-10-16
    • AIR WATER INCMURATA KIYOTAKASONE YOSHIHISA
    • MURATA KIYOTAKASONE YOSHIHISA
    • C08G14/04C08G59/62
    • C08G14/04C08G59/621C08L61/34C08L63/00C08L2666/22
    • Disclosed is a phenol polymer having flame retardance, fast curability and low melt viscosity, which is useful as a curing agent for epoxy resin-based semiconductor sealing materials. Also disclosed are a method for producing such a phenol polymer and use of such a phenol polymer. Specifically disclosed is a phenol polymer obtained by reacting a phenol, a bismethylbiphenyl compound and an aromatic aldehyde at such a ratio that the molar ratio of the total of the bismethylbiphenyl compound and the aromatic aldehyde relative to the phenol is 0.10-0.60 and the aromatic aldehyde/the bismethylbiphenyl compound (molar ratio) is from 5/95 to 50/50. Also specifically disclosed is an epoxy resin composition composed of such a phenol polymer and an epoxy resin.
    • 公开了具有阻燃性,快速固化性和低熔融粘度的苯酚聚合物,其可用作环氧树脂基半导体密封材料的固化剂。 还公开了制备这种苯酚聚合物的方法和使用这种苯酚聚合物。 具体公开了通过使苯酚,二甲基联苯化合物和芳族醛反应得到的苯酚聚合物,其比例是使双乙基联苯化合物和芳族醛相对于苯酚的摩尔比为0.10-0.60,芳族醛 /二甲基联苯化合物(摩尔比)为5/95〜50/50。 还具体公开了由这种苯酚聚合物和环氧树脂组成的环氧树脂组合物。
    • 9. 发明申请
    • HYDROGENATED AROMATIC OLIGOMERS AND PROCESS FOR THEIR PRODUCTION
    • 氢化芳族低聚物及其生产工艺
    • WO02006365A1
    • 2002-01-24
    • PCT/JP2001/006017
    • 2001-07-11
    • C08G8/28C08G14/04C08L61/14C08L61/34
    • C08L61/14C08G8/28C08G14/04C08L61/34
    • Hydrogenated aromatic oligomers represented by the general formula (1): (A - F)n - A (wherein A is a component which mainly comprises a polycyclic aromatic compound, a phenol, or a product of hydrogenation thereof and at least a part of which is constituted of the product of hydrogenation; F is methylene or dimethylene ether; and n is a number of 1 to 100). The oligomers are each prepared by reacting a polycyclic aromatic compound such as naphthalene with formaldehyde or a like compound and a phenol in the presence of an acid catalyst and then hydrogenating the obtained product. The oligomers are odorless, excellent in transparency, and useful in improving resins or rubbers in tackiness and damping properties, and exhibit excellent performances suitable for dampers particularly over a wide temperature range.
    • 由通式(1)表示的氢化芳族低聚物:(A-F)n-A(其中A是主要包含多环芳族化合物,苯酚或其氢化产物及其至少一部分的产物 由氢化产物构成; F为亚甲基或二亚甲基醚; n为1〜100的数)。 所述低聚物各自通过在酸催化剂存在下使多环芳族化合物如萘与甲醛等化合物和苯酚反应然后氢化所得产物来制备。 低聚物无臭,透明性优异,可用于改善粘合性和阻尼性能中的树脂或橡胶,并且具有适用于特别是在宽温度范围内的阻尼器的优异性能。