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    • 5. 发明申请
    • SEMICONDUCTOR SWITCH DEVICES AND THEIR MANUFACTURE
    • 半导体开关器件及其制造
    • WO9946821A3
    • 1999-11-25
    • PCT/IB9900202
    • 1999-02-04
    • KONINKL PHILIPS ELECTRONICS NVPHILIPS SVENSKA AB
    • SCHLIGTENHORST HOLGERHURKX GODEFRIDUS A MWARWICK ANDREW M
    • H01L29/73H01L21/329H01L21/331H01L29/732H01L29/868H01L21/04H01L29/772
    • H01L29/66136H01L29/66295H01L29/7325H01L29/868
    • In a semiconductor switch device such as an NPN transistor (T) or a power switching diode (D), a multiple-zone first region (1) of one conductivity type forms a switchable p-n junction (12) with a second region (2) of opposite conductivity type. In accordance with the invention, this first region (1) includes three distinct zones, namely a low-doped zone (23), a high-doped zone (25), and an intermediate additional zone (24). The low-doped zone (23) is provided by a semiconductor body portion (11) having a substantially uniform p-type doping concentration (P-) and forms the p-n junction (12) with the second region (2). The distinct additional zone (24) is present between the low-doped zone (23) and the high-doped zone (25). This triple-zone formation for the first region (1) permits an improvement in switching behaviour, e.g. in terms of fall-time and energy dissipation during turn-off of the device (T, D). A very low doping (P-) can be used for low-doped zone (23) so that, in the off-state of the device (T, D), this zone (23) and also the additional zone (24) can be fully depleted. The additional zone (24) having its additional doping concentration provides a path for extracting residual charge carriers from the low-doped zone (23) when the device (T, D) is being switched off.
    • 在诸如NPN晶体管(T)或功率开关二极管(D)的半导体开关器件中,一个导电类型的多区域第一区域(1)形成具有第二区域(2)的可切换pn结(12) 的相反导电类型。 根据本发明,该第一区域(1)包括三个不同的区域,即低掺杂区域(23),高掺杂区域(25)和中间附加区域(24)。 低掺杂区域(23)由具有基本均匀的p型掺杂浓度(P-)的半导体本体部分(11)提供,并与第二区域(2)形成p-n结(12)。 不同的附加区(24)存在于低掺杂区(23)和高掺杂区(25)之间。 用于第一区域(1)的这种三区形成允许改变开关行为,例如, 在设备(T,D)关闭期间的下降时间和能量耗散方面。 对于低掺杂区域(23),可以使用非常低的掺杂(P-),使得在器件(T,D)的截止状态下,该区域(23)以及附加区域(24)可以 充分耗尽 具有其附加掺杂浓度的附加区域(24)提供了当器件(T,D)被切断时从低掺杂区域(23)提取残余电荷载流子的路径。
    • 7. 发明申请
    • BIPOLAR POWER TRANSISTORS AND MANUFACTURING METHOD
    • 双极功率晶体管和制造方法
    • WO99012211A1
    • 1999-03-11
    • PCT/SE1998/001479
    • 1998-08-18
    • H01L21/205H01L21/331H01L21/74H01L29/08H01L29/73H01L21/265H01L23/66
    • H01L29/66295H01L21/74H01L29/0821H01L29/66272H01L29/73H01L2223/6644
    • The present invention relates to a bipolar power transistor intended for radio frequency applications, especially for use in an amplifier stage in a radio base station, and to a method for manufacturing the bipolar power transistor. The power transistor comprises a substrate (13), an epitaxial collector layer (15) on the substrate (13), a base (19) and an emitter (21) formed in the collector layer (15). The degree of doping Nc(x) of the collector layer varies from its upper surface (24) and downwards to at least half the depth of the collector layer, essentially according to a polynom of at least the second degree, a0 + a1, + a2x + ..., where a0 is the degree of doping at the upper surface (24); x is the vertical distance from the same surface (24) and a1, a2, ... are constants. The transistor can further comprise an at least approximately 2 mu m thick insulation oxide (17) between the epitaxial collector layer (15) and higher situated metallic connections layers (31, 33).
    • 本发明涉及用于无线电频率应用的双极功率晶体管,特别是用于无线电基站中的放大器级的双功能晶体管,以及制造双极型功率晶体管的方法。 功率晶体管包括衬底(13),在衬底(13)上的外延集电极层(15),形成在集电极层(15)中的基极(19)和发射极(21)。 集电极层的掺杂度Nc(x)从其上表面(24)向下变化到集电极层的深度的至少一半,基本上根据至少第二度的多项式a0 + a1 + a2x2 + ...,其中a0是上表面(24)处的掺杂度; x是与同一表面(24)的垂直距离,a1,a2,...是常数。 晶体管还可以包括在外延收集层(15)和较高位置的金属连接层(31,33)之间的至少约2μm厚的绝缘氧化物(17)。
    • 8. 发明申请
    • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • WO1997003458A1
    • 1997-01-30
    • PCT/JP1996001906
    • 1996-07-09
    • ROHM CO., LTD.SAKAMOTO, Kazuhisa
    • ROHM CO., LTD.
    • H01L21/322
    • H01L29/66295H01L21/263Y10S148/003Y10S148/004Y10S148/08Y10S148/09Y10S148/092
    • A method for manufacturing a semiconductor device in which crystal defects are generated in a semiconductor crystal by irradiating a semiconductor substrate (1) with a particle beam. In the preceding process of the irradiation process, the substrate (1) is heat-treated such that the temperature of the substrate (1) is raised rapidly in ten minutes to 550-850 DEG C and maintained for one second to 60 minutes. Crystal defects are generated in the crystal by irradiating the crystal with such a particle beam as an electron beam, the life time of carriers is shortened, and accordingly the switching speed is increased, not lowering the electric characteristics such as the current amplification factor. Thus a semiconductor device having both a high switching speed and good electric characteristics is fabricated.
    • 一种半导体器件的制造方法,其中通过用半导体衬底(1)照射粒子束,在半导体晶体中产生晶体缺陷。 在上述照射工序中,对基板(1)进行热处理,使基板(1)的温度在10分钟内快速上升至550〜850℃,保持1秒〜60分钟。 通过用诸如电子束的这种粒子束照射晶体,在晶体中产生晶体缺陷,载流子的寿命缩短,因此开关速度增加,不会降低诸如电流放大系数的电特性。 因此,制造具有高开关速度和良好电特性的半导体器件。