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    • 4. 发明申请
    • WEAR LEVELING METHOD AND APPARATUS
    • 磨损方法和装置
    • WO2012167642A1
    • 2012-12-13
    • PCT/CN2012/072372
    • 2012-03-15
    • TSINGHUA UNIVERSITYPAN, LiyangTANG, Chen
    • PAN, LiyangTANG, Chen
    • G06F12/06
    • G11C16/3495G11C29/822
    • The present invention discloses a wear leveling method; the method determines a pool mask for each physical block based on an erase number of each physical block. For different erase numbers, masks of the physical blocks are determined as cool pool mask CPM, normal pool mask NPM or hot pool mask HPM. When the pool mask of one physical block is changed from NPM to HPM, data of any physical block of which the pool mask is CPM is copied to the physical block of which the pool mask is HPM, and the physical block of which the pool mask is CPM is recycled as a garbage block. The present invention discloses a wear leveling apparatus, the method and apparatus can reduce additional wear caused by the wear leveling.
    • 本发明公开了一种磨损均衡方法; 该方法基于每个物理块的擦除次数确定每个物理块的池掩码。 对于不同的擦除号码,物理块的掩码被确定为酷池掩码CPM,普通池掩码NPM或热池掩码HPM。 当一个物理块的池掩码从NPM更改为HPM时,池掩码为CPM的任何物理块的数据将复制到池掩码为HPM的物理块,并且池掩码为 是将CPM作为垃圾块进行回收。 本发明公开了一种耐磨均衡装置,该方法和装置可以减少由磨损平整引起的附加磨损。
    • 7. 发明申请
    • A THREE-DIMENSIONAL MEMORY
    • 一个三维的记忆
    • WO03032372A8
    • 2003-09-18
    • PCT/CN0200703
    • 2002-09-29
    • ZHANG GUOBIAO
    • ZHANG GUOBIAO
    • G11C7/18G11C29/00H01L27/06H01L21/00
    • H01L29/76G11C7/18G11C17/06G11C17/14G11C29/822G11C29/846H01L23/58H01L27/0688
    • In a three-dimensional integrated memory (3DiM), three-dimensional memories (3D-Ms) are integrated with conventional readable and writeable memories and/or data processors on a single chip. The overall performance of a 3DiM (such as speed, rate of finished products, programmability and data security) is superior to that of standalone 3D-Ms. The invention provides various types of methodsfor improving the capability of integration of said 3D-Ms. In addition, the invention also provides further improvement in the structure, circuit design and the like of 3D-Ms. One important application field of 3D-Ms is the integrated circuit testing : a 3D-M loaded with test data may be integrated with a test circuit, and thereby realize self-testing and high-speed testing on the spot.
    • 在三维集成存储器(3DiM)中,三维存储器(3D-Ms)与传统的可读和可写存储器和/或数据处理器集成在单个芯片上。 3DiM的整体性能(如速度,成品率,可编程性和数据安全性)优于独立式3D-Ms。 本发明提供了各种提高3D-Ms整合能力的方法。 另外,本发明还提供了3D-Ms的结构,电路设计等方面的进一步改进。 3D-Ms的一个重要应用领域是集成电路测试:装载有测试数据的3D-M可以与测试电路集成,从而实现现场自检和高速测试。
    • 9. 发明申请
    • MEMORY REDUNDANCY CIRCUIT USING SINGLE POLYSILICON FLOATING GATE TRANSISTORS AS REDUNDANCY ELEMENTS
    • 使用单个多晶硅浮动栅极晶体管作为冗余元件的存储器冗余电路
    • WO1998019343A1
    • 1998-05-07
    • PCT/US1996017300
    • 1996-10-28
    • MACRONIX INTERNATIONAL CO., LTD.YIU, Tom, Dang-HsingSHONE, Fuchia
    • MACRONIX INTERNATIONAL CO., LTD.
    • H01L29/76
    • G11C29/80G11C29/822H01L27/115H01L29/7885
    • A read-only memory device (10) is provided which comprises an array of read-only memory cells arranged in rows and columns. An additional row (15) of flat, single polysilicon floating gate memory cells is provided. A row decoder (11) coupled to the array of read-only memory cells is responsive to addresses corresponding to rows in the array for selecting addressed rows. Control circuitry (18) including a programmable store for identifying a defective row in the array to be replaced by the additional row, selects the additional row and replaces the defective row in response to an address corresponding to the defective row. In addition, circuitry (19) is provided on the integrated circuit which allows access to the additional row of floating gate memory cells for programming the additional row. This structure is particularly applied to an array of mask ROM cells.
    • 提供了只读存储器件(10),其包括以行和列排列的只读存储器单元的阵列。 提供了另外一排(15)平坦的单个多晶硅浮动栅极存储单元。 耦合到只读存储器单元阵列的行解码器(11)响应于对应于阵列中的行的地址来选择寻址行。 控制电路(18)包括一个可编程存储器,用于识别阵列中由附加行替代的有缺陷的行,选择附加行并响应于与该有缺陷行相对应的地址替换该有缺陷行。 此外,在集成电路上提供电路(19),其允许访问用于编程附加行的附加行的浮动栅极存储器单元。 该结构特别适用于掩模ROM单元阵列。
    • 10. 发明申请
    • A ROM WITH RAM CELL AND CYCLIC REDUNDANCY CHECK CIRCUIT
    • 具有RAM单元和循环冗余校验电路的ROM
    • WO1993011488A1
    • 1993-06-10
    • PCT/JP1992001592
    • 1992-12-07
    • SEIKO EPSON CORPORATION
    • SEIKO EPSON CORPORATIONWILLIAM, C., Yung
    • G06F11/08
    • G11C29/822G06F11/1008G06F11/1076
    • An integrated circuit memory system and method having addressable memory locations for storing data, comprising a read-only memory section having addressable memory locations for storing read-only data, and a programmable memory section having programmable, addressable memory locations corresponding to predetermined ones of the read-only memory locations. The programmable memory locations are used to indicate whether the read-only data stored at the predetermined ones of the read-only memory locations is valid or invalid. A cyclic redundancy check (CRC) circuit is used to verify the integrity of the data stored in the ROM. In the event of one or more data errors, locations of the ROM containing the error, or the entire ROM, may be flagged as invalid.
    • 一种具有用于存储数据的可寻址存储器位置的集成电路存储器系统和方法,包括具有用于存储只读数据的可寻址存储器位置的只读存储器部分,以及具有可编程的可寻址存储器位置的可编程存储器部分, 只读存储单元。 可编程存储器位置用于指示存储在只读存储器位置中的预定存储器位置的只读数据是有效还是无效。 循环冗余校验(CRC)电路用于验证存储在ROM中的数据的完整性。 在发生一个或多个数据错误的情况下,包含该错误的ROM或整个ROM的位置可被标记为无效。