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    • 3. 发明申请
    • COMPOSITE ELECTROLESS NICKEL PLATING
    • 复合电镀镍镀层
    • WO2016007320A1
    • 2016-01-14
    • PCT/US2015/038295
    • 2015-06-29
    • MACDERMID ACUMEN, INC.
    • MORCOS, Boules, H.MICYUS, Nicole, J.PAWLOWSKI, John
    • C23C18/32
    • C23C18/1646C23C18/1662C23C18/1671C23C18/34C23C18/36
    • A method of producing a composite electroless nickel layer on a substrate is described. The method includes the steps of contacting the substrate with a composite electroless nickel plating bath and generating an electrostatic field in the electroless nickel plating bath. The electric field is generated by placing an anode in the electroless nickel plating bath and connecting the anode to a positive terminal of a DC rectifier, and connecting the substrate to a negative temiinal of the DC rectifier, and preferably inserting a capacitor into the circuit to prevent passage of current. An attractive force generated by the electrostatic field increases the attraction of the positively charged PTFE particles to the negatively charged substrate and drives the positively charged PTFE particles to the negatively charged substrate.
    • 描述了在基板上制造复合化学镀镍层的方法。 该方法包括以下步骤:使基底与复合无电镀镍浴接触,并在无电镀镍浴中产生静电场。 通过将阳极放置在化学镀镍浴中并将阳极连接到直流整流器的正极端子并将衬底连接到直流整流器的负端子,并且优选地将电容器插入到电路中以产生电场 防止电流流过。 由静电场产生的吸引力增加了带正电荷的PTFE颗粒对带负电荷的基底的吸引力,并将带正电的PTFE颗粒驱动到带负电荷的衬底上。
    • 7. 发明申请
    • SYSTEM AND METHOD FOR CONTROLLING AN ELECTROLESS DEPOSITION PROCESS
    • 用于控制电沉积工艺的系统和方法
    • WO2008058250A1
    • 2008-05-15
    • PCT/US2007/084144
    • 2007-11-08
    • SURFECT TECHNOLOGIES, INC.BASAME, Solomon B.ANDERSON, Steven M.XIE, Yixiang
    • BASAME, Solomon B.ANDERSON, Steven M.XIE, Yixiang
    • C23C18/16
    • C23C18/1601C23C18/1628C23C18/1671C23C18/1676
    • A method and system for controlling an electroless deposition process are provided. The system generally includes an electroless plating cell having a work piece to be plated positioned therein, the work piece also being positioned in communication with an electroless plating solution contained by the plating cell, and a voltage measurement device in communication with the work piece and the electroless plating solution, the voltage measurement device being configured to measure the electrical potential difference between the work piece and the plating solution. The system further includes a control voltage device in communication with the work piece and being configured to apply a determined control voltage to the work piece, and a system controller in communication with the voltage measurement device and the control voltage device, the system controller being configured to receive an input from the voltage measurement device and to generate a control voltage output corresponding to the determined control voltage, the output being sent to the control voltage device to cause the control voltage device to apply the determined control voltage to the work piece.
    • 提供了一种用于控制无电沉积工艺的方法和系统。 该系统通常包括具有被定位在其中的电镀工件的化学镀电池,工件还与镀电池所含的化学镀液相连通,以及与工件和 化学镀溶液,所述电压测量装置被配置为测量所述工件和所述电镀液之间的电位差。 该系统还包括与工件通信的控制电压装置,并且被配置为对所述工件施加确定的控制电压,以及与所述电压测量装置和所述控制电压装置通信的系统控制器,所述系统控制器被配置 为了从电压测量装置接收输入并产生对应于确定的控制电压的控制电压输出,该输出被发送到控制电压装置,以使控制电压装置将所确定的控制电压施加到工件。