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    • 6. 发明申请
    • SEMICONDUCTOR PROCESSING EQUIPMENT HAVING IMPROVED PARTICLE PERFORMANCE
    • 具有改进的粒子性能的半导体处理设备
    • WO0203427A3
    • 2002-04-11
    • PCT/US0120284
    • 2001-06-25
    • LAM RES CORPBOSCH WILLIAM FREDERICK
    • BOSCH WILLIAM FREDERICK
    • C04B41/00C04B41/80C23C16/44H01L21/00C23C16/50
    • C04B41/009C04B41/0054C04B41/80C23C16/4404H01J37/321C04B41/53C04B35/565C04B35/515
    • A ceramic part having a surface exposed to the interior space, the surface having been shaped and plasma conditioned to reduce particles thereon by contacting the shaped surface with a high intensity plasma. The ceramic part can be made by sintering or machining a chemically deposited material. During processing of semiconductor substrates, particle contamination can be minimized by the ceramic part as a result of the plasma conditioning treatment. The ceramic part can be made of various materials such as alumina, silicon dioxide, quartz, carbon, silicon, silicon carbide, silicon nitride, boron nitride, boron carbide, aluminum nitride or titanium carbide. The ceramic part can be various parts of a vacuum processing chamber such as a liner within a sidewall of the processing chamber, a gas distribution plate supplying the process gas to the processing chamber, a baffle plate of a showerhead assembly, a wafer passage insert, a focus ring surrounding the substrate, an edge ring surrounding an electrode, a plasma screen and/or a window.
    • 具有暴露于内部空间的表面的陶瓷部件,该表面已经成形并经等离子体处理以通过使成形表面与高强度等离子体接触来减少其上的颗粒。 陶瓷部件可以通过烧结或加工化学沉积的材料制成。 在处理半导体衬底期间,由于等离子体调节处理,陶瓷部件可以使颗粒污染最小化。 陶瓷部件可以由诸如氧化铝,二氧化硅,石英,碳,硅,碳化硅,氮化硅,氮化硼,碳化硼,氮化铝或碳化钛等各种材料制成。 陶瓷部分可以是真空处理室的不同部分,例如处理室侧壁内的衬里,将处理气体供给处理室的气体分配板,喷头组件的挡板,晶片通道插入件, 围绕衬底的聚焦环,围绕电极的边缘环,等离子体屏幕和/或窗口。
    • 7. 发明申请
    • LASER SYSTEM WITH CONTROLLABLE PULSE DURATION
    • 具有可控脉冲持续时间的激光系统
    • WO01043243A2
    • 2001-06-14
    • PCT/DE2000/004314
    • 2000-12-04
    • B23K26/06B23K26/067C04B41/00C04B41/80H01S3/23H01S3/00
    • B23K26/067B23K26/0604B23K26/0613C04B41/0036C04B41/009C04B41/80C04B2111/00844C04B41/0072C04B41/4578C04B35/00
    • The invention relates to a laser system, with controllable pulse duration, which comprises a generator device (10), with at least one pulsed laser (22), formed in such a way that said laser creates a first laser beam (16) and a second beam (18), spatially separate from the above first beam; a displacing device (12) formed in such a way that said device temporally shifts the second beam (18) with respect to the first beam (16); and a combining device (14), formed in such a way that said device combines both spatially separate laser beams (16, 18) in one output beam (20). Said laser system is particularly suitable for use in a method for the production of a crystalline ceramic layer by laser-annealing, whereby the temperature profile in the ceramic layer can be adjusted by controlling the pulse duration of the output beam of said laser system.
    • 本发明涉及一种具有可控的脉冲持续时间,其包括至少一个脉冲激光器(22)的激光系统,具有生成装置(10)和被设计为使得它产生第一激光束(16),并且该空间上分离的第二激光束中的一个(18); 位移装置(12),其被设计为使得其相对于第一激光束(16)及时地移动第二激光束(18); 和合并装置(14),其被布置成将两个空间分离的激光束(16,18)合并在输出光束(20)中。 此激光系统是特别适合于在用于制造由合适的激光退火,并且在该陶瓷层的温度分布的结晶陶瓷层的方法中使用,通过控制该激光系统的输出束的脉冲持续时间进行调整。
    • 10. 发明申请
    • MASKING ELEMENT FIXTURE
    • 屏蔽元件
    • WO1996010724A1
    • 1996-04-11
    • PCT/US1995012232
    • 1995-09-22
    • MATERIALS RESEARCH CORPORATION
    • MATERIALS RESEARCH CORPORATIONKOSHAK, Daniel, R.
    • F27D05/00
    • C04B41/009C04B35/52C04B41/0072C04B41/80C23C14/3414F27D5/0062
    • A fixture (10) for holding a plurality of masking elements (28, 30) while the masking elements are being baked to remove impurities is disclosed. The masking elements (28, 30) are used to mask dies used for forming sputtering targets used to deposit thin films on a substrate. The fixture (10) includes a housing (12) having first and second end walls (22, 24) connected between first and second side walls (18, 20) wherein the first and second end and side walls form an interior aperture (16). In addition, the fixture (10) includes several slots (26) which are formed in the first and second side walls (18, 20) wherein each of the slots (26) are suitable for holding a single masking element (28, 30). In particular, the interior aperture (16) is of a sufficient size and the slots (26) are positioned such that suitable air circulation is provided between each of the masking elements (28, 30) to expose the masking elements to a predetermined temperature suitable for removing the impurities from the masking elements. Furthermore, the fixture (10) includes openings (32) formed in the end walls (22, 24) which enable handling of the fixture and provide additional air circulation.
    • 公开了一种用于在掩蔽元件被烘烤以除去杂质的同时保持多个掩模元件(28,30)的夹具(10)。 掩模元件(28,30)用于掩模用于形成用于在衬底上沉积薄膜的溅射靶的模具。 固定装置(10)包括具有连接在第一和第二侧壁(18,20)之间的第一和第二端壁(22,24)的壳体(12),其中第一和第二端壁形成内孔(16) 。 另外,固定装置(10)包括形成在第一和第二侧壁(18,20)中的多个槽(26),其中每个槽(26)适于保持单个掩模元件(28,30) 。 特别地,内部孔(16)具有足够的尺寸并且狭槽(26)被定位成使得在每个掩蔽元件(28,30)之间提供合适的空气循环,以将掩模元件暴露于适当的预定温度 用于从掩蔽元件去除杂质。 此外,固定装置(10)包括形成在端壁(22,24)中的开口(32),其能够处理固定装置并提供额外的空气循环。