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    • 2. 发明申请
    • METHOD FOR THE MANUFACTURE OF AN EXTREMELY THIN FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARD AND A FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARD
    • 用于制造极薄的柔性多层印刷电路板和柔性多层印刷电路板的方法
    • WO2017134331A1
    • 2017-08-10
    • PCT/FI2016/050062
    • 2016-02-01
    • ELCOFLEX OY
    • TARVAINEN, Timo
    • H05K1/11H05K3/46H05K3/42B82Y30/00
    • H05K3/4635B82Y30/00H05K3/4069H05K3/4623H05K2201/035H05K2203/0723H05K2203/1545
    • In the manufacturing method of a multilayer printed circuit board and in a multilayer printed circuit board of the invention, at least part from insulating, conductive or semi-conductive layers remaining inside the multilayer printed circuit board there are manufactured a printed circuit board by using a roll-to-roll manufacturing method for two or several semi-finished printed circuit boards. Between the conductive printed layers of a semi-finished printed circuit board it is possible to manufacture electric vias connecting these by printing. A flexible multilayer printed circuit board is manufactured by connecting at least two semi-finished printed circuit boards face to face so that the pure surfaces of the metal foils of the semi-finished printed circuit boards remain outermost. After this holes can be manufactured through the flexible multilayer printed circuit board, which are metal-plated to produce an electric via.
    • 在本发明的多层印刷电路板和多层印刷电路板的制造方法中,至少部分来自保留在多层印刷电路板内部的绝缘层,导电层或半导电层, 通过使用用于两个或多个半成品印刷电路板的卷对卷制造方法来制造印刷电路板。 在半成品印刷电路板的导电印刷层之间,可以通过印刷来制造连接这些印刷电路板的电通孔。 柔性多层印刷电路板通过将至少两块半成品印刷电路板面对面地连接而制造,使得半成品印刷电路板的金属箔的纯表面保持最外面。 这些孔可以通过柔性多层印刷电路板制造,这些印刷电路板镀金属以生产电子通孔。
    • 4. 发明申请
    • METHOD FOR MANUFACTURING A FLEXIBLE CIRCUIT BOARD AND A FLEXIBLE CIRCUIT BOARD
    • 制造柔性电路板和柔性电路板的方法
    • WO2015028716A1
    • 2015-03-05
    • PCT/FI2014/050654
    • 2014-08-28
    • ELCOFLEX OY
    • TARVAINEN, TimoPAAVOLA, JuhoPELTONIEMI, Timo
    • H05K1/03H05K1/11H05K3/46H05K1/02B41J15/00
    • H05K3/4664H05K1/0393H05K2201/0355H05K2201/10098
    • In the manufacturing method according to the invention no separate working phases are needed for connecting the components of two conductive layers in desired places to each other by electrically conductive vias through the insulation layer. The vias are manufactured in connection with the manufacture of the insulating and conductive layers of the circuit board, which layers are appropriately patterned in connection with the manufacture. In the manufacturing method according to the invention, the first patterned insulation layer (22) is advantageously printed on the surface of a clean metal foil (21, 21 a), which is advantageously a copper foil. Holes are left in the insulation layer in places where the vias are to be manufactured. In the following manufacturing stages one or more conductive, semiconductive or insulating material layers (23, 24 25) are printed on the patterned insulation layer. The vias of the circuit board according to the invention are advantageously implemented by printing a conductive material (23) in the holes patterned in the first insulation layer (22), whereby an electrical contact from the printed conductive layer (23) to the metal foil (21, 21 a) is provided. Several patterned insulating and conductive layers can be printed on top of each other. After the material layers on the first surface of the circuit board have been printed, the side of the flexible circuit board manufactured by printing is attached to an appropriate support film (25). After this the copper conductors of the circuit board are patterned by etching to the second yet untreated surface of the metal foil. After the etching of the conductors a patterned insulating protective layer can be manufactured on the manufactured copper conductors of the circuit board for getting the circuit board ready for operation.
    • 在根据本发明的制造方法中,通过通过绝缘层的导电通孔,不需要单独的工作阶段来将所需位置中的两个导电层的组件彼此连接。 通孔与电路板的绝缘和导电层的制造相结合制造,该层与制造相结合地适当地构图。 在根据本发明的制造方法中,第一图案化绝缘层(22)有利地印刷在清洁金属箔(21,21a)的表面上,该金属箔有利地是铜箔。 在要制造通孔的地方,将孔留在绝缘层中。 在以下制造阶段中,在图案化的绝缘层上印刷一个或多个导电,半导体或绝缘材料层(23,24 25)。 根据本发明的电路板的通孔有利地通过在图案化在第一绝缘层(22)中的孔中印刷导电材料(23)来实现,由此从印刷导电层(23)到金属箔 (21,21a)。 几个图案化的绝缘和导电层可以印刷在彼此的顶部。 在电路板的第一表面上的材料层已被印刷之后,通过印刷制造的柔性电路板的一侧被附着到适当的支撑膜(25)上。 此后,电路板的铜导体通过蚀刻被图案化到金属箔的第二未处理表面。 在导体的蚀刻之后,可以在制造的电路板的铜导体上制造图案化的绝缘保护层,以使电路板准备好运行。
    • 7. 发明申请
    • WIRELESS CHARGING ARRANGEMENT
    • 无线收费安排
    • WO2015059351A1
    • 2015-04-30
    • PCT/FI2014/050784
    • 2014-10-16
    • ELCOFLEX OY
    • TARVAINEN, TimoPELTONIEMI, TimoPAAVOLA, Juho
    • H01F27/28H02J7/02
    • H02J50/10H01F27/2828H02J7/025
    • In a manufacturing method of the induction charger film according to the invention a first patterned insulation layer (15) is advantageously printed on the surface of a clean copper foil (130). In the following manufacturing stages one or more conductive (16), semi-conductive, insulating material layers or layers including graphics, are printed on the patterned insulation layer (15). When the material layers to be manufactured on the first surface of the induction charger film have been printed, the induction charger film is attached to an appropriate surface film (19). After this copper conductors (131-134) of the induction charger are patterned by etching from the second, yet untreated surface of the metal foil. After etching the conductors a ferrite film (14) is laminated underneath the primary coil (13) and the copper conductors (131-134) of the induction charger, with which ferrite film the magnetic flux created by the primary coil (13) is directed above the primary coil.
    • 在根据本发明的感应充电器膜的制造方法中,有利地将第一图案化绝缘层(15)印刷在干净的铜箔(130)的表面上。 在以下制造阶段,在图案化的绝缘层(15)上印刷一个或多个导电(16)半导体绝缘材料层或包括图形的层。 当在感应充电器膜的第一表面上制造的材料层已被印刷时,感应充电器膜附着到适当的表面膜(19)上。 在感应充电器的铜导体(131-134)通过蚀刻从金属箔的第二未处理表面进行图案化之后。 在对导体进行蚀刻之后,铁氧体膜层叠在感应充电器的初级线圈(13)和铜导体(131-134)的下面,铁氧体薄膜由初级线圈(13)产生的磁通量导向 在初级线圈之上。
    • 10. 发明申请
    • METHOD FOR MEASURING PHYSICAL CHARACTERISTICS AND MEASURING ARRANGEMENT TO BE UTILIZED IN THE METHOD
    • 测量方法中使用的物理特性和测量装置的方法
    • WO2018083379A1
    • 2018-05-11
    • PCT/FI2017/050748
    • 2017-10-30
    • ELCOFLEX OY
    • TARVAINEN, TimoPELTONIEMI, Timo
    • G01N27/02G01N22/00G01R27/26G06K7/10G06K19/02G06K19/07G06K19/077H01P3/08
    • G06K19/07749G06K7/10G06K19/0716G06K19/0723G06K19/07718G06K19/07786
    • An elongated measuring element (10) for physical characteristics fabricated onto a flexible dielectric substrate using a roll-to-roll manufacturing apparatus comprises a ground plane executed onto the lower surface of the flexible dielectric substrate (6), a microstrip line implemented onto the upper surface of the dielectric surface in its longitudinal direction, antenna elements (4) implemented adjacent to the microstrip line on the dielectric substrate, under which there is no ground plane, and at least two RFID tags (13A 1 , 13A 2 , 13A 3 , 13A 4 ) fabricated on a dielectric substrate, with a microcircuit (3) for measuring at least one physical characteristic in the object. The microcircuits (3) are connected galvanically to at least one antenna element (4) and galvanically or electro-magnetically to the microstrip line. At a first end of the microstrip line there is a control unit of a measuring element to control the RFID tags, which determines the physical characteristic to be measured by the measuring element, at least one transmission frequency to be used in the microstrip line when measuring the physical characteristic, transmits the response command to at least one RFID tag of the measuring element on at least one transmission frequency, receives a response message from at least one RFID tag, and indicates the prevailing value of the physical characteristic to be measured from the received response message.
    • 利用卷对卷制造设备制造到柔性绝缘衬底上的用于物理特性的细长测量元件(10)包括在柔性绝缘衬底(6)的下表面上执行的接地平面, ,在电介质表面的纵向上表面上实现的微带线,在电介质衬底上的微带线附近实现的天线元件(4),其下没有接地平面,并且至少两个RFID标签(13A 1),13A(下标2),13A(下标3),13A(下标4))和微电路 )用于测量物体中的至少一个物理特性。 微电路(3)电流连接到至少一个天线元件(4)并且电流地或电磁地连接到微带线。 在微带线的第一端,存在测量元件的控制单元,用于控制RFID标签,该RFID标签确定要由测量元件测量的物理特性,测量在测量微带线时将使用的至少一个传输频率 所述物理特性以至少一个传输频率向所述测量元件的至少一个RFID标签发送所述响应命令,从至少一个RFID标签接收响应消息,并且从所述物理特性中指示要测量的物理特性的主要值 收到响应消息。