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1. 发明申请

WO2005121931A1 DRIVE CARRIER 审中-公开
公开(公告)号：WO2005121931A1
公开(公告)日：2005-12-22
申请号：PCT/US2005/019655
申请日：2005-06-03
申请人： SUN MICROSYSTEMS, INC. , WILSON, Helenaur , WRYCRAFT, Sean, Conor , DONOVAN, Andrew
发明人： WILSON, Helenaur , WRYCRAFT, Sean, Conor , DONOVAN, Andrew
IPC分类号： G06F1/18
CPC分类号： G11B33/126 , G06F1/184 , G06F1/187 , G11B33/128
摘要： There is provided a drive carrier. The drive carrier is configured to receive a media drive and is also configured to be removably receivable in a receiving location of a computer system. The drive carrier includes a base portion, a handle portion and a latch mechanism for securing the carrier within the receiving location. The base portion and the handle portion are configured to co-operate to operate the latch mechanism on insertion and/or removal of the carrier from the receiving location, for inserting and/or removing the carrier from the receiving location and operating the latch mechanism with a single movement of the handle portion.
摘要翻译：提供了一个驱动器托架。驱动器托架被配置为接收介质驱动器，并且还被配置为可移除地容纳在计算机系统的接收位置。驱动载体包括基部，手柄部分和用于将载体固定在接收位置内的闩锁机构。基座部分和手柄部分构造成在从接收位置插入和/或移除载体时协作以操作闩锁机构，用于将载体从接收位置插入和/或移除并且用闩锁机构操作闩锁机构手柄部分的单个运动。

2. 发明申请

WO2005124860A2 MEMORY MODULE COOLING 审中-公开
标题翻译：内存模块冷却
公开(公告)号：WO2005124860A2
公开(公告)日：2005-12-29
申请号：PCT/US2005/019964
申请日：2005-06-07
申请人： SUN MICROSYSTEMS, INC. , GATES, William, George , HARRIS, Richard, John , WRYCRAFT, Sean, Conor
发明人： GATES, William, George , HARRIS, Richard, John , WRYCRAFT, Sean, Conor
IPC分类号： H01L23/367
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heatsink for a memory module includes a substantially planar contact portion for forming a thermal contact with the memory module and for mounting the heatsink on the memory module. One or more formations for emitting heat are also provided, the formations for emitting heat being in thermal communication with the contact portions.
摘要翻译：用于存储器模块的散热器包括用于与存储器模块形成热接触并用于将散热器安装在存储器模块上的基本上平面的接触部分。还提供了一个或多个用于发射热的结构，用于发射热量的结构与接触部分热连通。

3. 发明申请

WO2003041470A1 RACK-MOUNTABLE SYSTEMS 审中-公开
标题翻译：机架式系统
公开(公告)号：WO2003041470A1
公开(公告)日：2003-05-15
申请号：PCT/GB2002/005010
申请日：2002-11-07
申请人： SUN MICROSYSTEMS, INC. , WRYCRAFT, Sean, Conor
发明人： WRYCRAFT, Sean, Conor
IPC分类号： H05K7/10
CPC分类号： H05K7/1409
摘要： A rack-mounted assembly (10) comprises one or more racks, each capable of containing one or more printed circuit boards (PCB) (18), interconnected by a backplane (15) which is located along the bottom of a shelf (14). This position of the backplane (15) allows the rear wall of the rack-mounted assembly to be perforated, thereby permitting a cooling airflow for the PCBs to pass in through the front of the assembly and then out through the back. An insertion mechanism is provided to allow a PCB to be inserted into a rack. To achieve this, the PCB must first travel backwards into the rack-mounted assembly, and then downwards into engagement with the backplane (15). In one embodiment, this is accomplished by supporting the PCB from a hanger (100) which moves in and out of the rack-mounted assembly along a guide rail (45). The hanger includes slots (115) that retain pins (110) from the PCB. The slots are orientated diagonally upwards and backwards. A compression spring (60) is also provided to urge the pins (and hence PCB) forwards. Upon insertion, the hanger moves along guide rail (45) until the PCB abuts a stop (50). At this point further insertion of the hanger forces the pins (110) to move along slots (115) in opposition to spring (60), thereby driving the PCB down into engagement with the backplane (15).
摘要翻译：机架安装组件（10）包括一个或多个机架，每个机架能够容纳通过沿着架子（14）的底部定位的背板（15）互连的一个或多个印刷电路板（PCB）（18）。背板（15）的该位置允许机架安装组件的后壁穿孔，从而允许PCB的冷却气流通过组件的前部通过，然后穿过背部。提供插入机构以允许PCB插入机架中。为了实现这一点，PCB必须首先向后移动到机架安装的组件中，然后向下移动以与背板（15）接合。在一个实施例中，这是通过从沿着导轨（45）进出机架安装组件的衣架（100）支撑PCB来实现的。衣架包括从PCB保持销（110）的槽（115）。槽向上和向后倾斜定向。还提供压缩弹簧（60）以将销（以及因此PCB）向前推动。插入时，吊架沿着导轨（45）移动，直到PCB邻接止动件（50）。在这一点上，衣架的进一步插入迫使销（110）相对于弹簧（60）沿狭槽115移动，从而将PCB向下驱动以与背板（15）接合。

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