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    • 2. 发明申请
    • THREE DIMENSIONAL MEMORY SYSTEM WITH COLUMN PIPELINE
    • 具有柱管的三维存储系统
    • WO2012118618A1
    • 2012-09-07
    • PCT/US2012/025171
    • 2012-02-15
    • SANDISK 3D LLCYAN, TianhongBALAKRISHNAN, GopinathLEE, Jeffrey, Koon YeeLIU, Tz-yi
    • YAN, TianhongBALAKRISHNAN, GopinathLEE, Jeffrey, Koon YeeLIU, Tz-yi
    • G11C7/10G11C7/18G11C13/00G11C17/16
    • G11C7/1006G11C7/1012G11C7/1039G11C7/18G11C8/08G11C8/18G11C13/0004G11C13/0007G11C13/0026G11C13/0069G11C17/16
    • A monolithic three dimensional array of non-volatile storage elements is arranged in blocks. The non-volatile storage elements are connected to bit lines and word lines. The bit lines for each block are grouped into columns of bit lines. The columns of bit lines include top columns of bit lines that are connected to selection circuits on a top side of a respective block and bottom columns of bit lines that are connected to selection circuits on a bottom side of the respective block. Programming of data is pipelined between two or more columns of bit lines in order to increase programming speed. One embodiment of the programming process includes selectively connecting two columns of bit lines to a set of one or more selection circuits, using the one or more selection circuits to selectively connect one of the two columns of bit lines to one or more signal sources, programming non-volatile storage elements for the column of bit lines that is currently connected to the one or more signal sources, and changing one of the columns of bit lines connected to the set of one or more selection circuits while another column of bit lines is being programmed.
    • 非易失性存储元件的单片三维阵列以块状排列。 非易失性存储元件连接到位线和字线。 每个块的位线被分组成位线列。 位线列包括连接到相应块的顶侧上的选择电路的顶列和位于相应块的底侧上的选择电路的位线的底列。 数据的编程在两列或更多列的位线之间流水线化,以提高编程速度。 编程过程的一个实施例包括使用一个或多个选择电路选择性地将两列位线连接到一组或多个选择电路,以选择性地将两列位线中的一列连接到一个或多个信号源,编程 用于当前连接到一个或多个信号源的位线列的非易失性存储元件,以及改变连接到一组或多个选择电路的位线的列之一,而另一列位线正在被 程序。
    • 3. 发明申请
    • MEMORY SYSTEM WITH DATA LINE SWITCHING SCHEME
    • 具有数据线切换方案的存储器系统
    • WO2010123517A1
    • 2010-10-28
    • PCT/US2009/058889
    • 2009-09-29
    • SANDISK 3D LLCYAN, TianhongFASOLI, Luca
    • YAN, TianhongFASOLI, Luca
    • G11C8/12G11C13/00
    • G11C8/12G11C13/0064G11C13/0069G11C2013/0066
    • A storage system includes a three-dimensional memory array that has multiple layers of non-volatile storage elements grouped into blocks. Each block includes a subset of first selection circuits for selectively coupling a subset of array lines (e.g. bit lines) of a first type to respective local data lines. Each block includes a subset of second selection circuits for selectively coupling a subset of the respective local data lines to global data lines that are connected to control circuitry. To increase the performance of memory operations, the second selections circuits can change their selections independently of each other. For example, a memory operation is performed concurrently on a first non-volatile storage element of each group of a plurality of groups of non-volatile storage elements. Completion of the memory operation for the first non-volatile storage element of each group is independently detected. A memory operation on a second non-volatile storage element of each group is independently commenced for each group upon independently detecting completion of the memory operation for the first non-volatile storage element of the respective group.
    • 存储系统包括具有分组成块的多层非易失性存储元件的三维存储器阵列。 每个块包括用于选择性地将第一类型的阵列线(例如位线)的子集耦合到相应的本地数据线的第一选择电路的子集。 每个块包括用于选择性地将各个本地数据线的子集耦合到连接到控制电路的全局数据线的第二选择电路的子集。 为了增加存储器操作的性能,第二选择电路可以彼此独立地改变它们的选择。 例如,在多组非易失性存储元件的每组的第一非易失性存储元件上同时执行存储器操作。 独立检测每组的第一非易失性存储元件的存储器操作的完成。 在独立地检测对相应组的第一非易失性存储元件的存储器操作的完成时,对于每个组,在每个组的第二非易失性存储元件上的存储器操作被独立地开始。
    • 8. 发明申请
    • NON-VOLATILE 3D MEMORY WITH CELL-SELECTABLE WORD LINE DECODING
    • 非易失性3D存储器,具有细胞选择性字线解码
    • WO2015148399A1
    • 2015-10-01
    • PCT/US2015/022060
    • 2015-03-23
    • SANDISK 3D LLC
    • YAN, TianhongSCHEUERLEIN, Roy E.
    • H01L27/24
    • G11C13/0021G11C5/025G11C13/003G11C13/004G11C13/0069G11C17/16G11C2213/71G11C2213/77H01L27/249
    • A three-dimensional array of memory elements is formed across multiple layers of planes positioned at different distances above a semiconductor substrate. The memory elements are each accessible by a word line (WL) in a plane and a local bit line. The three-dimensional array includes a two-dimensional array of pillar lines (331, 332) through the multiple layers of planes. The pillar lines are of a first type (331) that act as local bit lines and a second type (332) that provide access to the word lines by having respective memory elements (348) preset to a permanently low resistance state for connecting second-type pillar lines for exclusive access to respective word lines. An array of metal lines on the substrate is switchably connected to the vertical bit lines to provide access to the local bit lines and the word lines.
    • 存储元件的三维阵列形成在位于半导体衬底上方不同距离的多个平面层上。 存储器元件各自可以通过平面中的字线(WL)和本地位线来访问。 三维阵列包括穿过多层平面的柱线(331,332)的二维阵列。 柱线是用作局部位线的第一类型(331)和第二类型(332),其通过将各自的存储元件(348)预设为永久低电阻状态来提供对字线的访问, 用于专用于相应字线的支柱线。 衬底上的金属线阵列可切换地连接到垂直位线以提供对局部位线和字线的访问。
    • 10. 发明申请
    • INTRINSIC VERTICAL BIT LINE ARCHITECTURE
    • 内部垂直位线架构
    • WO2015179537A1
    • 2015-11-26
    • PCT/US2015/031804
    • 2015-05-20
    • SANDISK 3D LLC
    • RATNAM, PerumalPETTI, ChristopherYAN, Tianhong
    • G11C7/18G11C13/00H01L27/24
    • G11C13/0026G11C7/18G11C2213/71H01L27/2454H01L27/249H01L45/04H01L45/06H01L45/085H01L45/1226H01L45/146
    • Methods for reducing leakage currents through unselected memory cells of a memory array during a memory operation are described. In some cases, the leakage currents through the unselected memory cells of the memory array may be reduced by setting an adjustable resistance bit line structure connected to the unselected memory cells into a non-conducting state. The adjustable resistance bit line structure may comprise a bit line structure in which the resistance of an intrinsic (or near intrinsic) polysilicon portion of the bit line structure may be adjusted via an application of a voltage to a select gate portion of the bit line structure that is not directly connected to the intrinsic polysilicon portion. The intrinsic polysilicon portion may be set into a conducting state or a non-conducting state based on the voltage applied to the select gate portion.
    • 描述了在存储器操作期间通过存储器阵列的未选择的存储单元减少泄漏电流的方法。 在一些情况下,可以通过将连接到未选择的存储器单元的可调电阻位线结构设置为非导通状态来减小通过存储器阵列的未选择存储单元的漏电流。 可调电阻位线结构可以包括位线结构,其中可以通过向位线结构的选择栅极部分施加电压来调整位线结构的本征(或近固有)多晶硅部分的电阻 其不直接连接到本征多晶硅部分。 本征多晶硅部分可以基于施加到选择栅极部分的电压而被设置为导通状态或非导通状态。