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    • 3. 发明申请
    • THERMAL MANAGEMENT IN A COMPUTING DEVICE BASED ON WORKLOAD DETECTION
    • 基于工作负载检测的计算机设备的热管理
    • WO2016160224A1
    • 2016-10-06
    • PCT/US2016/020002
    • 2016-02-29
    • QUALCOMM INCORPORATED
    • VOOTUKURU, AnilJAIN, AnkurVADAKKANMARUVEEDU, UnnikrishnanMITTER, VinayMEDRANO, Christopher Lee
    • G06F1/20G06F1/32G05D23/19G01K7/42
    • G06F1/206G01K7/427G01K13/00G05B15/02G06F1/203G06F1/3206G06F1/324G06F1/3243G06F1/3296Y02D10/126Y02D10/152Y02D10/172
    • Thermal management in a portable computing device differentiates between a temperature increase caused by a steady workload and a temperature increase caused by an instantaneous workload. If it is determined that a detected temperature increase is caused by a steady workload, then a configuration of thermal parameters is applied that optimizes thermal performance for a steady workload. If it is determined that a temperature increase is caused by an instantaneous workload increase, then a configuration of thermal parameters is applied that optimizes thermal performance for an instantaneous workload. The device includes at least one first temperature sensor on an integrated circuit die and at least one second temperature sensor not on the integrated circuit die but within a housing of the portable computing device. The workload is determined by computing a difference between a first temperature value responsive to the at least one first temperature sensor and a second temperature value responsive to the at least one second temperature sensor and comparing the difference with a threshold value.
    • 便携式计算设备中的热管理区分由稳定的工作负载导致的温度升高和由瞬时工作量引起的温度升高。 如果确定检测到的温度升高是由稳定的工作量引起的,则应用热参数的配置,其优化用于稳定工作负载的热性能。 如果确定温度升高是由瞬间工作量增加引起的,则应用热参数的配置,其优化了瞬时工作负荷的热性能。 该装置包括集成电路管芯上的至少一个第一温度传感器和不在集成电路管芯上但在便携式计算设备的外壳内的至少一个第二温度传感器。 通过计算响应于至少一个第一温度传感器的第一温度值和响应于至少一个第二温度传感器的第二温度值之间的差异并将差值与阈值进行比较来确定工作负荷。