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1. 发明申请

WO2006122692A2 LASER DEVICE FORMED BY A STACK OF LASER DIODES 审中-公开
标题翻译：由激光二极管堆叠形成的激光器件
公开(公告)号：WO2006122692A2
公开(公告)日：2006-11-23
申请号：PCT/EP2006004390
申请日：2006-05-10
申请人： LASAG AG , MONTI DI SOPRA FABRICE , FREI BRUNO
发明人： MONTI DI SOPRA FABRICE , FREI BRUNO
CPC分类号： H01S5/4025 , H01S5/02264 , H01S5/02272 , H01S5/02423 , H01S5/4018 , H01S5/4031
摘要： The laser device (22) is formed by a stack of laser diodes (4) placed on wafers (6) made of an electrically conductive material and having a good heat conductivity. In order to obtain a good efficiency in the evacuation of heat toward the cooling body (10) and to avoid the problems associated with an electrical short circuit, each wafer has, on its lower end (24), an electrically non-conductive layer placed on its surface before fastening to the cooling body by a fastening material (26) that preferably conducts heat well, formed, in particular, by a solder layer. According to the invention, the non-conductive layer covers the end side of each wafer and rises along the lateral sides thereof at a certain height. The invention provides that the fastening material is placed under the end of the wafer and that it also partially covers the non-conductive layer along the lateral sides of the wafer.
摘要翻译：激光装置（22）由放置在由导电材料制成并且具有良好导热性的晶片（6）上的一叠激光二极管（4）形成。为了在朝向冷却体（10）排出热量方面获得良好的效率，并且为了避免与电气短路相关的问题，每个晶片在其下端（24）上具有放置在非导电层在通过紧固材料（26）紧固到冷却体之前，其表面上优选地导热，特别是通过焊料层形成。根据本发明，非导电层覆盖每个晶片的端侧并且沿其横向侧面以一定的高度上升。本发明提供了紧固材料放置在晶片的端部之下，并且其还沿着晶片的横向侧面部分地覆盖非导电层。

2. 发明申请

WO2006122691A3 LASER DEVICE FORMED BY A STACK OF LASER DIODES 审中-公开
标题翻译：由激光二极管堆叠形成的激光器件
公开(公告)号：WO2006122691A3
公开(公告)日：2007-04-19
申请号：PCT/EP2006004389
申请日：2006-05-10
申请人： LASAG AG , MONTI DI SOPRA FABRICE , FREI BRUNO
发明人： MONTI DI SOPRA FABRICE , FREI BRUNO
IPC分类号： H01S5/40
CPC分类号： H01S5/4025 , H01S5/02264 , H01S5/02272 , H01S5/02423 , H01S5/4018 , H01S5/4031
摘要： The laser device (22) is formed by a stack of laser diodes (4) placed on wafers (6) made of an electrically conductive material and having a good heat conductivity. In order to obtain a good efficiency in the evacuation of heat toward the cooling body (10) and to avoid the problems associated with an electrical short circuit, each wafer has, on its lower end (24), an electrically non-conductive layer placed on its surface before fastening to the cooling body by a fastening material (26) that preferably conducts heat well, formed, in particular, by a solder layer. According to the invention, the non-conductive layer has a width that is sufficient for enabling the fastening material to partially cover the lateral sides of the non-conductive layers, and the fastening material extends between the wafers, i.e. so that it forms a continuous layer on the cooling body.
摘要翻译：激光装置（22）由放置在由导电材料制成并且具有良好导热性的晶片（6）上的一叠激光二极管（4）形成。为了在朝向冷却体（10）排出热量方面获得良好的效率，并且为了避免与电气短路相关的问题，每个晶片在其下端（24）上具有放置在非导电层通过紧固材料（26）紧固到冷却体之前，其表面优选地导热，特别是由焊料层形成。根据本发明，非导电层的宽度足以使紧固材料部分地覆盖非导电层的侧面，并且紧固材料在晶片之间延伸，即使其形成连续的层在冷却体上。

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