专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2014006536A3 MINIMALLY INVASIVE MEDICAL INSTRUMENT 审中-公开
公开(公告)号：WO2014006536A3
公开(公告)日：2014-01-09
申请号：PCT/IB2013/055199
申请日：2013-06-25
申请人： KONINKLIJKE PHILIPS N.V.
发明人： DEKKER, Ronald , HENNEKEN, Vincent Adrianus , VAN RENS, Antonia Cornelia
IPC分类号： A61B8/12 , A61B1/00 , H04B10/00 , A61B5/00 , G02B6/42
摘要： The present invention relates to a minimally invasive medical instrument (100) having a proximal end (100b) and a distal end (100a) and comprising a sensor arrangement (10) arranged at the distal end (100b) of the medical instrument (100). The sensor arrangement (10) comprises a sensor (20) configured to generate sensor data in the form of an electrical sensor signal, and a data conversion device (40) configured to convert the electrical sensor signal into an optical signal and comprising an electrical input (41) for receiving the electrical sensor signal and an optical output (42) for transmitting the optical signal. The sensor arrangement (10) further comprises an optical fiber (50) configured to transmit the optical signal from the distal end (100a) to the proximal end (100b), the optical fiber (50) coupled to the output of the data conversion device (40) for receiving the optical signal, the optical fiber (50) extending from the distal end(100a) to the proximal end (100b) of the instrument (100).The present invention further relates to a method of manufacturing such a minimally invasive medical instrument (100).

2. 发明申请

WO2016008833A1 TILED CMUT DIES WITH PITCH UNIFORMITY 审中-公开
标题翻译： TITED CMUT DIES WITH PITCH均质
公开(公告)号：WO2016008833A1
公开(公告)日：2016-01-21
申请号：PCT/EP2015/065943
申请日：2015-07-13
申请人： KONINKLIJKE PHILIPS N.V. , TECHNISCHE UNIVERSITEIT DELFT
发明人： SUDOL, Wojtek , DIRKSEN, Peter , HENNEKEN, Vincent Adrianus , DEKKER, Ronald , LOUWERSE, Marcus Cornelis
IPC分类号： B06B1/02 , B81C1/00 , G01N29/24 , H04R19/00
CPC分类号： B06B1/0292 , B81C1/00214 , G01N29/2406 , G01N29/262 , G01N2291/02475 , G01N2291/106 , H04R19/00
摘要： A large aperture CMUT transducer array is formed of a plurality of adjacently located tiles of CMUT cells. The adjacent edges of the tiles are formed by an anisotropic etch process, preferably a deep reactive ion etching process which is capable of cutting through the die and its substrate while maintaining vertical edges in close proximity to the CMUT cells at the edge of the tile. This enables the CMUT cells of continuous rows or columns to exhibit a constant pitch over multiple CMUT cell tiles. The tiles also contain interconnect electrodes along an edge for making electrical connections to the tiles with flex circuit.
摘要翻译：大孔径CMUT换能器阵列由多个相邻定位的CMUT单元的瓦片形成。瓷砖的相邻边缘通过各向异性蚀刻工艺形成，优选地是深反应离子蚀刻工艺，其能够切割模具及其衬底，同时保持垂直边缘紧邻瓷砖边缘处的CMUT单元。这使得连续行或列的CMUT单元能够在多个CMUT单元瓦片上展现恒定的间距。瓦片还包含沿着边缘的互连电极，用于通过柔性电路与瓦片进行电连接。

3. 发明申请

WO2015169771A1 ULTRASONIC TRANSDUCER CHIP ASSEMBLY, ULTRASOUND PROBE, ULTRASONIC IMAGING SYSTEM AND ULTRASOUND ASSEMBLY AND PROBE MANUFACTURING METHODS 审中-公开
标题翻译：超声波传感器芯片组件，超声波探头，超声波成像系统和超声波组件和探头制造方法
公开(公告)号：WO2015169771A1
公开(公告)日：2015-11-12
申请号：PCT/EP2015/059769
申请日：2015-05-05
申请人： KONINKLIJKE PHILIPS N.V. , TECHNISCHE UNIVERSITEIT DELFT
发明人： WEEKAMP, Johannes Wilhelmus , HENNEKEN, Vincent Adrianus , GROENLAND, Alfons Wouter , LOUWERSE, Marcus Cornelis
IPC分类号： B06B1/06 , G10K11/00
CPC分类号： B06B1/0622 , A61B8/4483 , G10K11/002 , H01L41/0472 , H01L41/1132 , H01L41/293
摘要： Disclosed is an ultrasonic transducer assembly comprising an ultrasonic transducer chip (100) having a main surface comprising a plurality of ultrasound transducer elements (112) and a plurality of first contacts (120) for connecting to said ultrasound transducer elements; a contact chip (400) having a further main surface comprising a plurality of second contacts (420); an backing member (300) comprising ultrasound absorbing and/or scattering bodies (310), said backing member comprising a first surface (302) on which the transducer chip is mounted and a second surface (306) on which the contact chip is mounted; and a flexible interconnect (200) extending over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks (210), each conductive track connecting one of said first contacts to a second contact. An ultrasound probe including such an assembly, an ultrasonic imaging system including such an ultrasound probes and manufacturing methods of such an assembly and probe are also disclosed.
摘要翻译：公开了一种超声换能器组件，其包括具有包括多个超声换能器元件（112）的主表面和用于连接到所述超声换能器元件的多个第一触点（120）的超声换能器芯片（100）具有另外的主表面的接触芯片（400）包括多个第二触点（420）; 包括超声波吸收和/或散射体（310）的背衬构件（300），所述背衬构件包括其上安装有所述换能器芯片的第一表面（302）和安装所述接触芯片的第二表面（306）以及柔性互连（200），其在所述背衬构件上从主表面延伸到另一主表面，所述柔性互连件包括多个导电轨道（210），每个导电轨道将所述第一触点中的一个连接到第二触点。还公开了包括这种组件的超声波探头，包括这种超声波探头的超声波成像系统和这种组件和探头的制造方法。

4. 发明申请

WO2021228729A1 AN ULTRASOUND TRANSDUCER AND A TILED ARRAY OF ULTRASOUND TRANSDUCERS 审中-公开
公开(公告)号：WO2021228729A1
公开(公告)日：2021-11-18
申请号：PCT/EP2021/062243
申请日：2021-05-08
申请人： KONINKLIJKE PHILIPS N.V.
发明人： HENNEKEN, Vincent Adrianus , VAN RENS, Antonia Cornelia , KLOOTWIJK, Johan Hendrik
IPC分类号： B06B1/02 , A61B8/00
摘要： An ultrasound transducer has a control circuit with an array of circuit portions, the used ones of which defining a circuit area. cMUT elements are provided over the top of the control circuit. Vias provide a coupling between each cMUT element and a respective one of the circuit portions beneath. At least some vias are located beneath the bottom electrode of the cMUT element and each via connects to the respective circuit portion at a same position relative to the circuit portion. The array of cMUT elements overlaps at least one side of the circuit area. The fixed via position makes the circuit design simpler, and the overlap enables tiling or else enables a modular design in which different cMUT designs may be used with the same circuit.

5. 发明申请

WO2019110698A1 ROLLED FLEXIBLE SUBSTRATE WITH NON-PERPENDICULAR TRANSDUCER SEPARATION FOR INTRALUMINAL ULTRASOUND IMAGING DEVICE 审中-公开
公开(公告)号：WO2019110698A1
公开(公告)日：2019-06-13
申请号：PCT/EP2018/083708
申请日：2018-12-06
申请人： KONINKLIJKE PHILIPS N.V.
发明人： HENNEKEN, Vincent Adrianus , LOUWERSE, Marcus Cornelis , DEKKER, Ronald , JACOBS, Egbertus Reinier , WEEKAMP, Johannes Wilhelmus
IPC分类号： B06B1/02 , B06B1/06
CPC分类号： B06B1/0215 , B06B1/0633 , B06B2201/76
摘要： An intraluminal ultrasound imaging device includes a flexible elongate member configured for insertion into a body lumen of a patient. The device includes an ultrasound scanner assembly disposed at the distal portion of the flexible elongate member. The ultrasound scanner assembly includes a flexible substrate, a control region including a plurality of controllers disposed on the flexible substrate, and a transducer region including a plurality of transducer elements disposed on the flexible substrate. Each pair of adjacent transducer elements of the plurality of transducer elements includes non-perpendicular sidewalls defining a trench between the adjacent transducer elements. Associated devices, systems, and methods are also described.

6. 发明申请

WO2015135784A2 ULTRASOUND TRANSDUCER ASSEMBLY AND METHOD FOR MANUFACTURING AN ULTRASOUND TRANSDUCER ASSEMBLY 审中-公开
标题翻译：超声波换能器组件及制造超声波换能器组件的方法
公开(公告)号：WO2015135784A2
公开(公告)日：2015-09-17
申请号：PCT/EP2015/054301
申请日：2015-03-02
申请人： KONINKLIJKE PHILIPS N.V. , TECHNISCHE UNIVERSITEIT DELF
发明人： DEKKER, Ronald , HENNEKEN, Vincent Adrianus , LOUWERSE, Marcus Cornelis , RAGANATO, Maria Filomena
IPC分类号： B06B1/02
CPC分类号： B06B1/0292 , A61B8/12 , A61B8/445 , A61B8/4494 , G01N29/2406 , G01N2291/101
摘要： The present invention relates to an ultrasound transducer assembly (10), in particular for intravascular ultrasound systems. The ultrasound transducer assembly comprises at least one silicon substrate element (30) including an ultrasound transducer element (14) for emitting and receiving ultrasound waves and including electrical connectors for electrically connecting the transducer element. The substrate element has a top surface (44), a bottom surface (46) and a side surface connecting the top surface and the bottom surface. An isolation layer (32, 50) forms the side surface for electrically isolating the substrate element.
摘要翻译：本发明涉及特别用于血管内超声系统的超声换能器组件（10）。超声换能器组件包括至少一个硅衬底元件（30），其包括用于发射和接收超声波的超声换能器元件（14），并且包括用于电连接换能器元件的电连接器。衬底元件具有顶面（44），底面（46）和连接顶面和底面的侧面。隔离层（32,50）形成用于电隔离衬底元件的侧表面。

7. 发明申请

WO2019110699A1 ROLLED FLEXIBLE SUBSTRATE FOR INTRALUMINAL ULTRASOUND IMAGING DEVICE 审中-公开
公开(公告)号：WO2019110699A1
公开(公告)日：2019-06-13
申请号：PCT/EP2018/083709
申请日：2018-12-06
申请人： KONINKLIJKE PHILIPS N.V.
发明人： WEEKAMP, Johannes Wilhelmus , HENNEKEN, Vincent Adrianus , LOUWERSE, Marcus Cornelis , DEKKER, Ronald , JACOBS, Egbertus Reinier
IPC分类号： A61B8/12 , A61B8/00 , B06B1/06 , B06B1/02 , H05K1/18 , A61B8/08
摘要： An intraluminal ultrasound imaging device includes a flexible elongate member configured to be inserted into a body lumen of a patient, the flexible elongate member comprising a proximal portion and a distal portion. The device also includes an ultrasound scanner assembly disposed at the distal portion of the flexible elongate member. The ultrasound scanner assembly includes a flexible substrate; a transducer region positioned on the flexible substrate; and a control region positioned on the flexible substrate, wherein the transducer region and the control region are radially arranged relative to one another. Associated devices, systems, and methods are also described.

8. 发明申请

WO2019002231A1 INTRALUMINAL ULTRASOUND IMAGING DEVICE COMPRISING A SUBSTRATE SEPARATED INTO A PLURALITY OF SPACED-APART SEGMENTS, INTRALUMINAL ULTRASOUND IMAGING DEVICE COMPRISING A TRENCH, AND METHOD OF MANUFACTURING 审中-公开
公开(公告)号：WO2019002231A1
公开(公告)日：2019-01-03
申请号：PCT/EP2018/067006
申请日：2018-06-26
申请人： KONINKLIJKE PHILIPS N.V.
发明人： DEKKER, Ronald , HENNEKEN, Vincent Adrianus , LOUWERSE, Marcus Cornelis , ARSLAN CARISEY, Aslihan
IPC分类号： B06B1/02 , A61B8/12 , A61B8/00 , B06B1/06 , H01L41/053
摘要： An intraluminal ultrasound imaging device includes a flexible elongate member configured to be positioned within a body lumen of a patient. The flexible elongate member includes a proximal portion and a distal portion. The device also includes an ultrasound imaging assembly disposed at the distal portion of the flexible elongate member. The ultrasound imaging assembly is configured to obtain imaging data of the body lumen. The ultrasound imaging assembly includes a transducer array including a substrate, a silicon oxide layer disposed over the substrate, and a plurality of rows of micromachined ultrasound transducer elements disposed on the silicon oxide layer. Two of the plurality of rows of micromachined ultrasound transducer elements are spaced apart by a trench formed by etching through a screen formed in the silicon oxide layer. Associated devices, systems, and methods are also provided.

9. 发明申请

WO2016091985A1 CATHETER TRANSDUCER WITH STAGGERED COLUMNS OF MICROMACHINED ULTRASONIC TRANSDUCERS 审中-公开
标题翻译：带超声波超声波传感器柱塞的导管传感器
公开(公告)号：WO2016091985A1
公开(公告)日：2016-06-16
申请号：PCT/EP2015/079180
申请日：2015-12-10
申请人： KONINKLIJKE PHILIPS N.V. , TECHNISCHE UNIVERSITEIT DELFT
发明人： HENNEKEN, Vincent Adrianus , LOUWERSE, Marcus Cornelis , DEKKER, Ronald
IPC分类号： B06B1/02
CPC分类号： A61B8/4494 , A61B8/12 , B06B1/0292
摘要： A CMUT transducer array comprising a first column (58) of spaced CMUT cells on at least one silicon island, a second column (58) of spaced CMUT cells on at least one further silicon island, the second column being staggered in alignment with the first column such that cells of the second column are partially located in spaces between successive cells of the first column, the first column and the second column being spaced apart by a gap, and a flexible foil retaining the respective silicon islands, the flexible foil comprising conductive interconnects.
摘要翻译： CMUT换能器阵列包括在至少一个硅岛上的间隔开的CMUT单元的第一列（58），在至少一个另外的硅岛上的间隔开的CMUT单元的第二列（58），所述第二列与第一列柱，使得第二列的单元部分地位于第一列的连续单元之间的空间中，第一列和第二列间隔开间隙，以及保持相应硅岛的柔性箔，柔性箔包括导电互连。

10. 发明申请

WO2016008690A1 ULTRASOUND TRANSDUCER ARRANGEMENT AND ASSEMBLY, COAXIAL WIRE ASSEMBLY, ULTRASOUND PROBE AND ULTRASONIC IMAGING SYSTEM 审中-公开
标题翻译：超声波传感器布置和组装，同轴线组件，超声波探头和超声成像系统
公开(公告)号：WO2016008690A1
公开(公告)日：2016-01-21
申请号：PCT/EP2015/064365
申请日：2015-06-25
申请人： KONINKLIJKE PHILIPS N.V.
发明人： HENNEKEN, Vincent Adrianus , LOUWERSE, Marcus Cornelis , WEEKAMP, Johannes Wilhelmus , DEKKER, Ronald , NOTTEN, Marc Godfriedus Marie , VAN RENS, Antonia Cornelia Jeannet
IPC分类号： B06B1/02 , B06B1/06
CPC分类号： B06B1/0292 , A61B8/12 , A61B8/445 , A61B8/4494 , B06B1/0622 , H01R4/023 , H01R12/515
摘要： An ultrasound transducer arrangement (100) is disclosed comprising a plurality of substrate islands (110, 120, 130) spatially separated and electrically interconnected by a flexible polymer assembly (150) including electrically conductive tracks providing said electrical interconnections, said plurality including a first substrate island (110) comprising a plurality of ultra sound transducer cells (112) and a second substrate island (120) comprising an array of external contacts for connecting the ultrasound sensor arrangement to a flexible tubular body including a coaxial wire assembly (200) comprising a plurality of coaxial wires (220) each having a conductive core (228) covered by an electrically insulating sleeve (226); and an electrically insulating body (210) having a first main surface (211), a second main surface (213) and a plurality of through holes (212) each extending from the first main surface to the second main surface and coated with an electrically conductive member, wherein each coaxial wire comprises an exposed terminal core portion mounted in one of said though holes from the first main surface, and wherein each through hole is sealed by a solder bump (214) on the second main surface such that the ultrasound transducer arrangement can be directly mounted on the flexible tubular body without the need for a PCB.
摘要翻译：公开了一种超声换能器装置（100），其包括通过柔性聚合物组件（150）在空间上分离和电互连的多个衬底岛（110,120,130），所述柔性聚合物组件包括提供所述电互连的导电轨迹，所述多个包括第一衬底包括多个超声换能器单元（112）的岛（110）和包括用于将所述超声波传感器装置连接到包括同轴线组件（200）的柔性管体的外部触头阵列的第二衬底岛（120）多个同轴电线（220），每个同轴导线（220）具有由电绝缘套筒（226）覆盖的导电芯（228）。以及具有第一主表面（211），第二主表面（213）和多个通孔（212）的电绝缘体（210），每个通孔从第一主表面延伸到第二主表面并且涂覆有电导电构件，其中每个同轴线包括从第一主表面安装在所述通孔中的一个中的暴露端子芯部分，并且其中每个通孔由第二主表面上的焊料凸块（214）密封，使得超声换能器布置可以直接安装在柔性管状体上，而不需要PCB。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式