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    • 2. 发明申请
    • SELF-CALIBRATED THERMAL SENSORS OF AN INTEGRATED CIRCUIT DIE
    • 集成电路的自校准热传感器
    • WO2014200819A1
    • 2014-12-18
    • PCT/US2014/041157
    • 2014-06-05
    • INTEL CORPORATIONABDELMONEUM, Mohamed A.DUARTE, David E.TAYLOR, Gregory F.
    • ABDELMONEUM, Mohamed A.DUARTE, David E.TAYLOR, Gregory F.
    • H01L27/14
    • G01K15/005G01K7/00G01K7/32
    • Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein resonator is thermally coupled with circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate first temperature corresponding with first frequency of the resonator in the first mode using a first equation, calculate second temperature corresponding with second frequency of the resonator in the second mode using a second equation, and add offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.
    • 本公开的实施例提供集成电路(IC)裸片的自校准热传感器以及相关联的技术和配置。 在一个实施例中,自校准热感测装置包括谐振器,其配置为在与集成电路(IC)管芯的电路的温度相对应的频率下振荡,其中谐振器与电路热耦合并且被配置为以第一模式操作, 第二模式和与所述谐振器可操作地耦合的逻辑,并且被配置为使用第一等式在所述第一模式中计算与所述谐振器的第一频率相对应的第一温度,使用第二模式计算与所述谐振器的第二频率相对应的第二温度 等式,并且基于第一温度和第二温度的比较结果,将第一等式和第二等式相加。 可以描述和/或要求保护其他实施例。