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1. 发明申请

WO2015163845A1 ALIGNMENT FIXTURES FOR INTEGRATED CIRCUIT PACKAGES 审中-公开
标题翻译：集成电路组件的对准配置
公开(公告)号：WO2015163845A1
公开(公告)日：2015-10-29
申请号：PCT/US2014/034827
申请日：2014-04-21
申请人： INTEL CORPORATION , CHIGULLAPALLI, Sruti , SANCHEZ, Rene J. , ABAZARNIA, Nader N. , COONS, Todd R. , GOH, Tuan Hoong
发明人： CHIGULLAPALLI, Sruti , SANCHEZ, Rene J. , ABAZARNIA, Nader N. , COONS, Todd R. , GOH, Tuan Hoong
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： G01R31/2891 , G01R1/0408 , G01R1/0483 , G01R31/2863
摘要： Embodiments of alignment fixtures for integrated circuit (IC) packages, and related techniques, are disclosed herein. In some embodiments, an alignment fixture for an IC package may include: a first socket having a recess dimensioned to receive a first surface of the IC package and having a first magnet arrangement disposed outside of the recess, wherein the IC package has a second surface opposite to the first surface and has a first electrical contact element on the second surface; and a second socket having a second electrical contact element and having a second magnet arrangement. The first and second electrical contact elements may be aligned when the IC package is disposed in the recess, the IC package is disposed between the first and second sockets, and the first magnet arrangement is in a predetermined equilibrium relation with the second magnet arrangement to mate the first and second sockets.
摘要翻译：集成电路（IC）封装的对准夹具的实施例以及相关技术在本文中公开。在一些实施例中，用于IC封装的对准夹具可以包括：第一插座，其具有尺寸设计成容纳IC封装的第一表面的凹部，并且具有设置在凹部外部的第一磁体布置，其中IC封装具有第二表面与第一表面相对并且在第二表面上具有第一电接触元件; 以及具有第二电接触元件并具有第二磁体布置的第二插座。当IC封装设置在凹槽中时，第一和第二电接触元件可以对准，IC封装设置在第一和第二插座之间，并且第一磁体布置与第二磁体布置处于预定的平衡关系以配合第一和第二个插座。

2. 发明申请

WO2018118279A1 THERMAL MANAGEMENT OF MOLDED PACKAGES 审中-公开
公开(公告)号：WO2018118279A1
公开(公告)日：2018-06-28
申请号：PCT/US2017/061653
申请日：2017-11-15
申请人： INTEL CORPORATION
发明人： EID, Feras , ABAZARNIA, Nader N. , SWAN, Johanna M. , BEASLEY, Taesha D. , OSTER, Sasha N. , HARIRCHIAN, Tannaz , LIFF, Shawna M.
IPC分类号： H01L23/28 , H01L25/07 , H01L23/12 , H01L23/485 , H01L21/56
摘要： An embodiment includes an apparatus comprising: a semiconductor die; package molding that is molded onto and conformal with a first die surface of the semiconductor die and at least two sidewalls of the semiconductor die, the package molding including: (a)(i) a first surface contacting the semiconductor die, (a)(ii) a second surface opposite the first surface, and (a)(iii) an aperture that extends from the first surface to the second surface; and a polymer substantially filling the aperture; wherein the package molding includes a first thermal conductivity (watts per meter kelvin (W/(m•K)) and the polymer includes a second thermal conductivity that is greater than the first thermal conductivity. Other embodiments are described herein.

3. 发明申请

WO2017204978A1 DIAMOND-LIKE CARBON COATED SEMICONDUCTOR EQUIPMENT 审中-公开
标题翻译：类金刚石碳涂层半导体设备
公开(公告)号：WO2017204978A1
公开(公告)日：2017-11-30
申请号：PCT/US2017/029649
申请日：2017-04-26
申请人： INTEL CORPORATION
发明人： CULIC-VISKOTA, Jelena , ABAZARNIA, Nader N.
IPC分类号： H01L21/66 , H01L21/324
CPC分类号： G01R31/2601 , C23C14/0605 , C23C14/16 , C23C16/06 , C23C16/26 , C23C28/32 , C23C28/322 , C23C28/343 , G01R1/04 , G01R1/44 , H01L21/67092 , H01L21/67103 , H01L21/68757
摘要： Embodiments of the present disclosure describe semiconductor equipment devices having a metal workpiece and a diamond-like carbon (DLC) coating disposed on a surface of the metal workpiece, thermal semiconductor test pedestals having a metal plate and a DLC coating disposed on a surface of the metal plate, techniques for fabricating thermal semiconductor test pedestals with DLC coatings, and associated configurations. A thermal semiconductor test pedestal may include a metal plate and a DLC coating disposed on a surface of the metal plate. The metal plate may include a metal block formed of a first metal and a metal coating layer formed of a second metal between the metal block and the DLC coating. An adhesion strength promoter layer may be disposed between the metal coating layer and the DLC coating. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例描述了具有金属工件和设置在金属工件的表面上的类金刚石碳（DLC）涂层的半导体设备装置，具有金属板和热敏半导体测试基座的热半导体测试基座设置在金属板表面上的DLC涂层，用于制造具有DLC涂层的热半导体测试基座的技术以及相关配置。热半导体测试基座可以包括金属板和设置在金属板的表面上的DLC涂层。金属板可以包括由第一金属形成的金属块和在金属块和DLC涂层之间由第二金属形成的金属涂层。粘合强度促进剂层可以设置在金属涂层和DLC涂层之间。其他实施例可以被描述和/或要求保护。

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