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    • 1. 发明申请
    • AN ELECTRICALLY CONDUCTIVE, HOT-MELT ADHESIVE OR MOULDING COMPOSITION
    • 一种导电的热熔粘合剂或模塑组合物
    • WO2017182621A1
    • 2017-10-26
    • PCT/EP2017/059504
    • 2017-04-21
    • HENKEL AG & CO. KGAAHENKEL IP & HOLDING GMBH
    • CAI, JeffreyBRIERS, DavidPOOLE, CallumDREEZEN, GuntherCHAPMAN, AnthonySTARKEY, Dale R.
    • H01B1/22H05K9/00C09J9/02
    • C09J9/02C08K3/04C08K3/08C08K7/06C08K9/02C08K2003/0806C08K2003/0831C08K2003/0862C08K2201/001C08K2201/003C08K2201/016C09J11/04C09J177/00H01B1/22C08L77/00
    • The present invention is related to an electrically conductive, hot-melt adhesive or moulding composition, said composition comprising: a) a binding agent which comprises at least one (co)polymer selected from the group consisting of polyamide, thermoplastic polyamide, copolyamide, polyolefins, poly(meth)acrylates, polystyrene, polyurethanes, polyesters, ethylene copolymers, ethylene vinyl copolymers, styrenic block copolymers, polylactic acid, silicones, epoxies and polyols; and, b) a conductive filler comprising particles (p1 ) which have a mass median diameter (D50) of ≤100 microns and which are selected from the group consisting of flakes, platelets, leaf-like particles, dendritic particles, rods, tubes, fibres, needles and mixtures thereof, wherein said composition has a melt viscosity of from 2500 to 25000 mPa-s as measured at 210°C and is further characterized in that said particles (p1 ) constitute from 15 to 70 wt.%, by weight of the composition. Preferably, the binding agent comprises at least one (co)polymer selected from the group consisting of polyamide, thermoplastic polyamide and copolyamide.
    • 本发明涉及导电的热熔粘合剂或模塑组合物,所述组合物包含:a)粘合剂,其包含至少一种选自以下的(共)聚合物: 聚酰胺,热塑性聚酰胺,共聚酰胺,聚烯烃,聚(甲基)丙烯酸酯,聚苯乙烯,聚氨酯,聚酯,乙烯共聚物,乙烯乙烯共聚物,苯乙烯嵌段共聚物,聚乳酸,硅氧烷,环氧树脂和多元醇; 和b)包含颗粒(p1)的导电填料,所述颗粒具有≤100微米的质量中值直径(D50)并且选自薄片,薄片,叶状颗粒,树枝状颗粒,棒,管, 纤维,针状物及其混合物,其中所述组合物在210℃下测得的熔体粘度为2500至25000mPa-s,并且其特征还在于所述颗粒(p1)构成15至70重量% 的组成。 优选地,粘合剂包含至少一种选自聚酰胺,热塑性聚酰胺和共聚酰胺的(共)聚合物。