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1. 发明申请

WO2008029376A2 DEPOSITION OF CONDUCTIVE POLYMER AND METALLIZATION OF NON-CONDUCTIVE SUBSTRATES 审中-公开
标题翻译：导电聚合物的沉积和非导电基板的金属化
公开(公告)号：WO2008029376A2
公开(公告)日：2008-03-13
申请号：PCT/IB2007/053617
申请日：2007-09-07
申请人： ENTHONE INC. , LACHOWICZ, Agata , GLÖCKNER, Andreas
发明人： LACHOWICZ, Agata , GLÖCKNER, Andreas
IPC分类号： C25D5/54 , C25D5/56 , C25D3/38 , H05K3/42
CPC分类号： C25D5/56 , C09D5/24 , C09D5/4476 , C09D5/4484 , C25D3/38 , H05K3/424 , H05K3/427 , H05K2201/0329
摘要： A process is provided for metallizing a surface of a substrate with electrolytically plated copper metallization, the process comprising electrolytically depositing copper over the electrically conductive polymer by immersing the substrate in an electrolytic composition and applying an external source of electrons, wherein the electrolytic composition comprises a source of copper ions and has a pH between about 0.5 and about 3.5. In another aspect, a process is provided for metallizing a surface of a dielectric substrate with electrolytically plated copper metallization, the process comprising immersing the substrate into a catalyst composition comprising a precursor for forming an electrically conductive polymer on the surface of the dielectric substrate and a source of Mn (II) ions in an amount sufficient to provide an initial concentration of Mn (II) ions of at least about 0.1 g/L to form an electrically conductive polymer on the surface of the dielectric substrate, and electrolytically depositing copper over said electrically conductive polymer.
摘要翻译：提供了一种用电镀铜金属化金属化衬底的表面的方法，该方法包括通过将衬底浸入电解组合物中并施加外部电子源在导电聚合物上电解沉积铜，其中电解组合物包含铜离子源，pH约在0.5至约3.5之间。在另一方面，提供了一种用电解铜镀金属化金属化电介质基片的表面的方法，该方法包括将基底浸入包含用于在电介质基底表面上形成导电聚合物的前体的催化剂组合物和 Mn（II）离子源，其量足以提供至少约0.1g / L的Mn（II）离子的初始浓度，以在介电衬底的表面上形成导电聚合物，并在所述电介质衬底的表面上电解沉积铜导电聚合物。

2. 发明申请

WO2016116876A1 COMPOSITIONS INCLUDING A HIGH MOLECULAR WEIGHT ACID SUITABLE FOR CONDUCTIVE POLYMER FORMATION ON DIELECTRIC SUBSTRATES 审中-公开
标题翻译：包含高分子量酸的组合物，适用于导电聚合物在电介质基材上的形成
公开(公告)号：WO2016116876A1
公开(公告)日：2016-07-28
申请号：PCT/IB2016/050277
申请日：2016-01-20
申请人： ENTHONE INC.
发明人： RIETMANN, Christian , GLÖCKNER, Andreas
IPC分类号： C09D5/44 , C25D5/56
CPC分类号： C09D5/44 , C25D3/38 , C25D5/02 , C25D5/56 , H05K3/423 , H05K3/426 , H05K2201/0329
摘要： The invention relates to a composition and a process for the deposition of conductive polymers on dielectric substrates. In particular, the invention relates to a composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising at least one polymerizable monomer which is capable to form a conductive polymer, an emulsifier and an acid, characterized in that the composition comprises at least one metal-ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, boron-ions, indium-ions and alkyl imidazolium-ions. The acid is typically a high molecular weight polymeric acid having molecular weight of at least 500,000 Da including, for example, polystyrene sulfonic acid having a molecular weight of approximately 1,000,000 Da.
摘要翻译：本发明涉及用于在电介质基底上沉积导电聚合物的组合物和方法。特别地，本发明涉及用于在电介质基底的表面上形成导电聚合物的组合物，该组合物包含至少一种可形成导电聚合物，乳化剂和酸的可聚合单体，其特征在于，所述组合物包含选自锂离子，钠离子，铝离子，铍离子，铋离子，硼离子，铟离子和烷基咪唑鎓离子中的至少一种金属离子。酸通常是分子量至少为500,000Da的高分子量聚合酸，包括例如分子量约为1,000,000Da的聚苯乙烯磺酸。

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