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    • 2. 发明申请
    • LASER-SEEDING FOR ELECTRO-CONDUCTIVE PLATING
    • 用于导电镀层的激光种子
    • WO2017173281A1
    • 2017-10-05
    • PCT/US2017/025392
    • 2017-03-31
    • ELECTRO SCIENTIFIC INDUSTRIES, INC.
    • SCHRAUBEN, JoelKLEINERT, Jan
    • H01L23/15H01L21/268H01L23/14
    • A workpiece (100) having substrate, such as a glass substrate, can be etched by a laser or by other means to create recessed features (200, 202). A laser- induced forward transfer (LIFT) process or metal oxide printing process can be employed to impart a seed material (402), such as a metal, onto the glass substrate, especially into the recessed features (200, 202). The seeded recessed features can be plated, if desired, by conventional techniques, such as electroless plating, to provide conductive features (500) with predictable and better electrical properties. The workpieces (100) can be connected in a stacked such that subsequently stacked workpieces (100) can be modified in place.
    • 具有诸如玻璃基板的基板的工件(100)可以通过激光或其他手段来蚀刻以形成凹陷结构(200,202)。 激光诱导正向转移(LIFT)工艺或金属氧化物印刷工艺可用于将诸如金属的种子材料(402)施加到玻璃基板上,特别是施加到凹陷结构(200,202)中。 如果需要,可以通过常规技术(如无电电镀)对籽晶凹陷结构进行电镀,以提供具有可预测的和更好的电性能的导电部件(500)。 工件(100)可以堆叠连接,使得随后堆叠的工件(100)可以被修改到位。