专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2020058815A1 FLEXIBLE DEVICE INCLUDING CONDUCTIVE TRACES WITH ENHANCED STRETCHABILITY 审中-公开
公开(公告)号：WO2020058815A1
公开(公告)日：2020-03-26
申请号：PCT/IB2019/057719
申请日：2019-09-12
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： SHAH, Saagar A. , PEKUROVSKY, Mikhail L. , MAHAJAN, Ankit , PEKUROVSKY, Lyudmila A. , CHIU, Jessica , LARSEN, Jeremy K. , MEYERS, Kara A. , GOEDDEL, Teresa M. , METZLER, Thomas J. , KEMLING, Jonathan W. , POKORNY, Richard J. , COONCE, Benjamin R. , AMB, Chad M. , KLUN, Thomas P.
IPC分类号： H01L23/538 , H01L23/498 , H01L23/50
摘要： Flexible devices including conductive traces with enhanced stretchability, and methods of making and using the same are provided. The circuit die is disposed on a flexible substrate. Electrically conductive traces are formed in channels on the flexible substrate to electrically contact with contact pads of the circuit die. A first polymer liquid flows in the channels to cover a free surface of the traces. The circuit die can also be surrounded by a curing product of a second polymer liquid.

2. 发明申请

WO2018229609A1 STRETCHABLE CONDUCTORS 审中-公开
公开(公告)号：WO2018229609A1
公开(公告)日：2018-12-20
申请号：PCT/IB2018/054105
申请日：2018-06-07
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： MAHAJAN, Ankit , ZHU, James , SHAH, Saagar A. , PEKUROVSKY, Mikhail L. , KRISHNAN, Vivek , REDDY, Kevin T. , WALKER, Christopher B. Jr. , KROPP, Michael A. , MEYERS, Kara A. , GOEDDEL, Teresa M. , METZLER, Thomas J. , KEMLING, Jonathan W. , BARTON, Roger W.
IPC分类号： H01B7/06 , A41D1/00
摘要： A stretchable conductor includes a substrate with a first major surface and an elongate wire, wherein the substrate is an elastomeric material, the elongate wire is on the first major surface of the substrate, the wire includes a first end and a second end, and further includes at least one arcuate region between the first end and the second end. At least one portion of the arcuate region of the wire in the region has a first surface area portion embedded in the surface of the substrate and a second surface area portion unembedded on the substrate and exposed in an amount sufficient to render at least an area of the substrate in the region electrically conductive. The unembedded second surface portion of the arcuate region may lie above or below a plane of the substrate. Additionally, different methods of preparing said stretchable conductor are disclosed. Composite articles including said stretchable conductor in durable electrical contact with a conductive fabric are also disclosed.

3. 发明申请

WO2019193457A1 ELECTRICAL DEVICE HAVING JUMPER 审中-公开
公开(公告)号：WO2019193457A1
公开(公告)日：2019-10-10
申请号：PCT/IB2019/052491
申请日：2019-03-27
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： GOEDDEL, Teresa M. , MAHAJAN, Ankit , PEKUROVSKY, Mikhail L. , METZLER, Thomas J. , SHAH, Saagar A. , MEYERS, Kara A. , KEMLING, Jonathan W. , LARSEN, Jeremy K.
IPC分类号： H05K3/12 , H05K3/46 , H05K1/09 , H05K3/10
摘要： Processes of making an electrical jumper (120) for electrical devices are provided. A micro-replication stamp (300) is used to press a layer of curable material (124) on a circuit substrate (102) to make patterned features. A conductive liquid (230) is disposed into the patterned features to make electrically conductive traces (126) that pass over a circuitry (110) and connect electrical contacts (122A, 122B). In some cases, the stamp (300) has a standoff (310).

4. 发明申请

WO2021111279A1 CIRCUITS INCLUDING MICROPATTERNS AND USING PARTIAL CURING TO ADHERE DIES 审中-公开
公开(公告)号：WO2021111279A1
公开(公告)日：2021-06-10
申请号：PCT/IB2020/061289
申请日：2020-11-30
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： GOEDDEL, Teresa M. , MAHAJAN, Ankit , PEKUROVSKY, Mikhail L. , SHAH, Saagar A. , MEYERS, Kara A. , WALKER, Christopher G.
IPC分类号： H01L21/60 , H01L21/58 , H01L23/488 , H05K3/36
摘要： A method comprises: providing a layer of curable adhesive material (4) on a substrate (2); forming a pattern of microstructures (321) on the layer of curable adhesive material (4); curing a first region (42) of the layer of curable adhesive material (4) at a first level and a second region (44) of the layer of curable adhesive material (4) at a second level greater than the first level; providing a solid circuit die (6) to directly attach to a major surface of the first region (42) of the layer of curable adhesive material (4); and further curing the first region (42) of the layer of curable adhesive material (4) to anchor the solid circuit die (6) on the first region (42) by forming an adhesive bond therebetween. The pattern of microstructures (321) may include one or more microchannels (321), the method further comprising forming one or more electrically conductive traces in the microchannels (321), in particular, by flow of a conductive particle containing liquid (8) by a capillary force and, optionally, under pressure. The at least one microchannel (321) may extend from the second region (44) to the first region (42) and have a portion beneath the solid circuit die (6). The solid circuit die (6) may have at least one edge disposed within a periphery of the first region (42) with a gap therebetween. The solid circuit die (6) may have at least one contact pad (72) on a bottom surface thereof, wherein the at least one contact pad (72) may be in direct contact with at least one of the electrically conductive traces in the microchannels (321). Forming the pattern of microstructures (321) may comprise contacting a major surface of a stamp (3) to the layer of curable adhesive material (4), the major surface having a pattern of raised features (32) thereon. The curable adhesive material (4) may be cured by an actinic light source such as an ultraviolet (UV) light source (7, 7'), wherein a mask may be provided to at least partially block the first region (42) of the layer of curable adhesive material (4) from the cure. The stamp (3) may be positioned in contact with the curable adhesive material (4) to replicate the pattern of raised features (32) to form the microstructures (321) while the curable adhesive material (4) is selectively cured by the actinic light source such as the ultraviolet (UV) light source (7). The first region (42) of the layer of curable adhesive material (4) may be cured at the first level to allow a bottom surface of the solid circuit die (6) to be fluidly-sealed by the major surface of the first region (42). The second region of the layer of curable adhesive material (4) may be cured at the second level such that the second region (44) is fully cured. The further curing may be any suitable curing such as thermal curing, radiation curing (e.g., by actinic radiation, such as ultraviolet (UV) radiation) or self-curing at room temperature without using a thermal or radiation curing source.

5. 发明申请

WO2019171214A1 AUTOMATIC REGISTRATION BETWEEN CIRCUIT DIES AND INTERCONNECTS 审中-公开
公开(公告)号：WO2019171214A1
公开(公告)日：2019-09-12
申请号：PCT/IB2019/051585
申请日：2019-02-27
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： MAHAJAN, Ankit , PEKUROVSKY, Mikhail L. , SHAH, Saagar A. , METZLER, Thomas J. , MEYERS, Kara A. , ZHU, James , GOEDDEL, Teresa M. , PEKUROVSKY, Lyudmila A. , KEMLING, Jonathan W. , LARSEN, Jeremy K.
IPC分类号： H01L23/528 , H01L23/00 , H01L23/31 , H01L23/29 , H01L25/065
摘要： Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed at a registration area of a substrate. Fluid channels extend into the registration area and have a portion underneath the bottom surface of the solid circuit die. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward contact pads on the bottom surface of the circuit die to obtain the automatic registration.

6. 发明申请

WO2018094057A1 AUTOMATIC REGISTRATION BETWEEN CIRCUIT DIES AND INTERCONNECTS 审中-公开
公开(公告)号：WO2018094057A1
公开(公告)日：2018-05-24
申请号：PCT/US2017/062030
申请日：2017-11-16
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： MAHAJAN, Ankit , PEKUROVSKY, Mikhail L. , STAY, Matthew S. , THEIS, Daniel J. , GILMAN, Ann M. , DODDS, Shawn C. , METZLER, Thomas J. , SMITH, Matthew R. D. , BARTON, Roger W. , HERNANDEZ, Joseph E. , SHAH, Saagar A. , MEYERS, Kara A. , ZHU, James , GOEDDEL, Teresa M. , PEKUROVSKY, Lyudmila A. , KEMLING, Jonathan W. , LARSEN, Jeremy K. , CHIU, Jessica , NICCUM, Kayla
IPC分类号： H01L25/07 , H01L27/02
摘要： Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式