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    • 1. 发明申请
    • 果実・子実の品質改良剤
    • 用于改善水果/谷物品质的试剂
    • WO2003013240A1
    • 2003-02-20
    • PCT/JP2002/007831
    • 2002-08-01
    • 味の素株式会社弦間 洋倉内 雅彦竹内 誠
    • 弦間 洋倉内 雅彦竹内 誠
    • A01N3/00
    • A01N43/36
    • Agents for improving the qualities of fruits/grains which contain proline as the active ingredient characterized by being an aqueous solution having a concentration of proline with a purity of 50% or above of 15 to 1,500 ppm in terms of proline; and a method of improving the qualities of fruits/grains characterized by comprising applying an aqueous proline solution having a concentration of proline with a purity of 50% or above of 15 to 1,500 ppm in terms of proline to foliage of a fruiting plant in the fruit/grain enlargement stage, the flower bud formation stage or before. Thus excellent agents for improving the qualities of fruits/grains and a method of improving the qualities of fruits/grains using the same are provided.
    • 用于提高含有脯氨酸作为活性成分的水果/谷物的质量的试剂,其特征在于以脯氨酸计纯度为50%以上的脯氨酸浓度为15〜1,500ppm; 以及提高水果/谷物质量的方法,其特征在于包括将脯氨酸纯度为50%以上的脯氨酸浓度为15〜1500ppm的脯氨酸水溶液施用于果实中的果实植物的叶子 /颗粒扩大阶段,花芽形成阶段或之前。 因此,提供了用于提高水果/谷物品质的优异剂,以及使用其提高水果/谷物品质的方法。
    • 7. 发明申请
    • 金属表面保護膜形成剤及びその使用
    • 金属表面保护膜成型剂及其应用
    • WO2003012169A1
    • 2003-02-13
    • PCT/JP2002/004180
    • 2002-04-26
    • 味の素株式会社古田 清敬倉内 雅彦佐藤 弘之
    • 古田 清敬倉内 雅彦佐藤 弘之
    • C23F11/00
    • C09G1/02C09G1/04C23C22/68C23F3/00C23F3/04C23F11/144H01L21/3212
    • A metal surface protection film forming agent containing a specific &agr;−amino acid such as leucine and phenyl alanine, and a metal abrasive liquid using this. The agent can be used as an abrasive liquid used in a chemical−mechanical polishing method in semiconductor circuit fabrication, is composed of various safe additives light in environmental load, and can restrict the dishing of metal wiring especially copper metal wiring and corrosion during polishing. Such a specific &agr;−amino acid used adsorbs to a wiring metal surface, especially a copper metal surface buried in a substrate recess or reacts with the metal to prevent the elution of the metal and forms a protection film on the metal surface. A metal surface protection film forming agent and a method of polishing a substrate surface for producing a semiconductor−use substrate, a method of forming a metal surface protection film, the application of the specific amino acid to a metal surface protection film forming agent, and a semiconductor circuit−use substrate using them, a semiconductor circuit containing it and methods of producing them.
    • 含有特定的氨基酸(如亮氨酸和苯丙氨酸)的金属表面保护膜形成剂和使用该金属的研磨液。 该试剂可用作半导体电路制造中的化学机械研磨方法中使用的研磨液,由环境负荷中的各种安全添加剂组成,并且可以限制金属布线特别是铜金属布线的凹陷和抛光期间的腐蚀。 所用的这种特定的氨基酸吸附到布线金属表面,特别是埋在基底凹槽中的铜金属表面,或与金属反应,以防止金属溶出并在金属表面形成保护膜。 金属表面保护膜形成剂和用于制造半导体用基板的基板表面的抛光方法,形成金属表面保护膜的方法,特定氨基酸在金属表面保护膜形成剂中的应用,以及 使用它们的半导体电路用基板,包含它的半导体电路及其制造方法。