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    • 1. 发明申请
    • 窒化物半導体素子およびその製造方法
    • 氮化物半导体元件及其生产方法
    • WO2002078069A1
    • 2002-10-03
    • PCT/JP2002/002980
    • 2002-03-27
    • ソニー株式会社小林 俊雅簗嶋 克典山口 恭司中島 博
    • 小林 俊雅簗嶋 克典山口 恭司中島 博
    • H01L21/205
    • H01L21/0242H01L21/0254H01L21/02639H01L21/0265H01L31/1852H01L33/007H01S5/0207H01S5/22H01S5/32341H01S2304/12Y02E10/544
    • A nitride semiconductor element which is so constituted as to be high in reliability and freedom of element design and manufacture, and which comprises seed crystal portions (11) formed on a sapphire substrate (10) and each having a mask (12) one side face thereof, and GaN layers (15) grown by a lateral-direction growth method on the sapphire substrate (10) and the seed crystal portions (11). Since a GaN layer (15) grows only from the side face, exposed and not covered by a mask (12), of a seed crystal portion (11), its lateral-direction growth progresses asymmerically and, therefore, a meeting portion (32) is formed to extent from near the interface between a seed crystal portion (11) and a mask (12) in a GaN layer (15) thickness direction. A meeting portion (32) formed in a position deviated in parallel to the substrate surface from the center between adjacent seed crystal portions (11) provides a structure in which the width W>L P
    • 一种氮化物半导体元件,其构造为具有高的元件设计和制造的可靠性和自由度,并且包括形成在蓝宝石衬底(10)上并且每个具有掩模(12)的晶圆部分(11),一个侧面 以及在蓝宝石衬底(10)和晶种部分(11)上通过横向生长方法生长的GaN层(15)。 由于氮化镓层(15)仅从种子晶体部分(11)的侧面露出并未被掩模(12)覆盖,所以其横向生长过程非均匀地进行,因此会聚部分(32) )形成为在GaN层(15)厚度方向上靠近晶种部分(11)和掩模(12)之间的界面的程度。 形成在与相邻晶种部分(11)之间的中心平行于基板表面的位置的会合部分(32)提供了一种结构,其中横向方向生长区域的宽度W> L>相对于 种子晶体部分(11)的间距W> P <大于常规结构。