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1. 发明申请

WO2010002832A3 ABRASIVE SLICING TOOL FOR ELECTRONICS INDUSTRY 审中-公开
标题翻译：电子工业用抛光工具
公开(公告)号：WO2010002832A3
公开(公告)日：2010-05-06
申请号：PCT/US2009049158
申请日：2009-06-30
申请人： SAINT GOBAIN ABRASIVES INC , SAINT GOBAIN ABRASIFS SA , WALIA PARUL , RAMANATH SRINIVASAN , HALL RICHARD W
发明人： WALIA PARUL , RAMANATH SRINIVASAN , HALL RICHARD W
IPC分类号： B24D3/04 , B24D3/06 , B24D3/10
CPC分类号： B24D3/06 , B24D5/12
摘要： A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations.
摘要翻译：用于金属粘合研磨工具的粘结基质包括金属粘结体系，孔隙度和任选的填料。根据本发明的实施例的工具显示出长的刀具寿命，产生可接受的切割质量并且可具有自修饰性能。键合矩阵可以用于例如为电子工业配置的磨料工具，例如用于切割球栅阵列（BGA）的1A8轮和其它这样的切片操作。

2. 发明申请

WO2010002832A2 ABRASIVE SLICING TOOL FOR ELECTRONICS INDUSTRY 审中-公开
标题翻译：电子工业用磨料切片工具
公开(公告)号：WO2010002832A2
公开(公告)日：2010-01-07
申请号：PCT/US2009/049158
申请日：2009-06-30
申请人： SAINT-GOBAIN ABRASIVES, INC. , SAINT-GOBAIN ABRASIFS , WALIA, Parul , RAMANATH, Srinivasan , HALL, Richard, W.
发明人： WALIA, Parul , RAMANATH, Srinivasan , HALL, Richard, W.
IPC分类号： B24D3/04 , B24D3/06 , B24D3/10
CPC分类号： B24D3/06 , B24D5/12
摘要： A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations.
摘要翻译：用于金属粘结研磨工具的粘结基质包括金属粘结体系，孔隙率和任选的填料。根据本发明的实施例的工具表现出长的工具寿命，产生可接受的切割质量并且可以具有自修整特性。例如，可以在为电子工业配置的研磨工具中使用该粘结基体，例如用于切割球栅阵列（BGA）的1A8轮和其他这种切片操作。

3. 发明申请

WO2009045940A1 ABRASIVE PROCESSING OF HARD AND/OR BRITTLE MATERIALS 审中-公开
标题翻译：硬质和/或脆性材料的磨料加工
公开(公告)号：WO2009045940A1
公开(公告)日：2009-04-09
申请号：PCT/US2008/078071
申请日：2008-09-29
申请人： SAINT-GOBAIN ABRASIVES, INC. , SAINT-GOBAIN ABRASIFS , RAMANATH, Srinivasan , WALIA, Parul
发明人： RAMANATH, Srinivasan , WALIA, Parul
IPC分类号： B24D3/10 , B24D18/00
CPC分类号： B24D3/10 , B24D18/0009
摘要： Abrasive articles possessing a highly open (porous) structure and uniform abrasive grit distribution are disclosed. The abrasive articles are fabricated using a metal matrix and the open structure is controlled with a porosity scheme, including interconnected porosity (e.g., formed by leaching dispersoid), closed porosity (e.g., induced by adding hollow micro-spheres and/or sacrificial pore-forming additives), and/or intrinsic porosity (e.g., controlled via matrix component selection to provide desired densification). In some cases, manufacturing process temperatures for achieving near full density of metal bond with fillers and abrasives are below the melting point of the filler used, although sacrificial fillers may be used as well. The abrasive articles are useful in high performance cutting and grinding operations, such as back-grinding silicon, alumina titanium carbide, and silicon carbide wafers to very fine surface finish values. Techniques of use and manufacture are also disclosed.
摘要翻译：公开了具有高度开放（多孔）结构和均匀的磨料砂粒分布的磨料制品。使用金属基体制造研磨制品，并且开孔结构由孔隙度方案控制，包括相互连通的孔隙度（例如通过浸出分散体形成），闭孔率（例如通过添加空心微球和/或牺牲孔 - 形成添加剂）和/或固有孔隙率（例如，通过基质组分选择进行控制以提供所需的致密化）。在某些情况下，尽管可以使用牺牲填料，但用填料和研磨剂实现接近全密度金属粘合的制造工艺温度低于所用填料的熔点。磨料制品可用于高性能切割和磨削操作，例如后研磨硅，氧化铝碳化钛和碳化硅晶片，以非常精细的表面光洁度值。还公开了使用和制造技术。

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