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    • 7. 发明申请
    • SMOOTH SICONI ETCH FOR SILICON-CONTAINING FILMS
    • 用于含硅片的SMOOTH SICONI蚀刻
    • WO2011087580A1
    • 2011-07-21
    • PCT/US2010/057676
    • 2010-11-22
    • APPLIED MATERIALS, INC.TANG, JingINGLE, NitinYANG, Dongqing
    • TANG, JingINGLE, NitinYANG, Dongqing
    • H01L21/3065
    • H01L21/31116H01J37/32357H01J2237/3341
    • A method of etching silicon-containing material is described and includes a SiConi™ etch having a greater or lesser flow ratio of hydrogen compared to fluorine than that found in the prior art. Modifying the flow rate ratios in this way has been found to reduce roughness of the post-etch surface and to reduce the difference in etch-rate between densely and sparsely patterned areas. Alternative means of reducing post-etch surface roughness include pulsing the flows of the precursors and/or the plasma power, maintaining a relatively high substrate temperature and performing the SiConi™ in multiple steps. Each of these approaches, either alone or in combination, serve to reduce the roughness of the etched surface by limiting solid residue grain size.
    • 描述了蚀刻含硅材料的方法,并且包括与现有技术中发现的氢相比具有更大或更小的氢流量比的SiConiTM蚀刻。 已经发现以这种方式修改流速比降低了蚀刻后表面的粗糙度并且减少了密集和稀疏图案化区域之间的蚀刻速率的差异。 降低蚀刻后表面粗糙度的替代方法包括脉冲前体和/或等离子体功率的流动,维持相对高的衬底温度并以多个步骤执行SiConiTM。 单独或组合的这些方法中的每一种用于通过限制固体残余物颗粒尺寸来减少蚀刻表面的粗糙度。