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    • 1. 发明申请
    • TEST UNIT AND TEST SYSTEM
    • 测试单元和测试系统
    • WO2010140643A1
    • 2010-12-09
    • PCT/JP2010/059400
    • 2010-05-27
    • TOKYO ELECTRON LIMITEDSATO, YoheiKATAOKA, Kenichi
    • SATO, YoheiKATAOKA, Kenichi
    • H01L21/66G01R31/28
    • G01R31/2887G01R31/3025H01L2924/0002H01L2924/00
    • A test unit to be used with a tester that tests an electrical characteristic of a circuit formed in a wafer includes a tester board electrically connected to the tester; a first wireless port mounted on a lower surface of the tester board and electrically connected to the tester; a probe board that includes a probe to be in contact with an electrode pad of the electronic circuit, and is configured so that the probe board may be transferred along with the wafer into the system box while the probe and the electrode pad are in contact with each other; a second wireless port that is mounted on an upper surface of the probe board and electrically connected to the probe, and carries out contactless transmission/reception with the first wireless port; a chuck plate that is away from the tester board, and holds the probe board and the wafer; and a flexible expandable chamber that may be inflated by introducing gas thereinto.
    • 与测试晶片中形成的电路的电特性的测试器一起使用的测试单元包括电连接到测试器的测试器板; 安装在测试器板的下表面上并电连接到测试器的第一无线端口; 探针板,其包括与电子电路的电极焊盘接触的探针,并且被构造成使得探针板可以与晶片一起转移到系统箱中,同时探针和电极焊盘与 彼此; 第二无线端口,其安装在所述探针板的上表面上并电连接到所述探针,并且与所述第一无线端口执行非接触式发送/接收; 离开测试器板的夹盘,并保持探针板和晶片; 以及可以通过将气体引入其而膨胀的柔性可膨胀室。