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    • 10. 发明申请
    • FLAME RETARDANT COMPOSITIONS
    • 阻燃剂组合物
    • WO2003097745A1
    • 2003-11-27
    • PCT/US2003/015331
    • 2003-05-15
    • DOW CORNING CORPORATIONDOW CORNING TORAY SILICONE CO., LTD.ROMENESKO, DavidSCHMIDT, RandallTOGASHI, AtsushiWIEBER, Gary
    • ROMENESKO, DavidSCHMIDT, RandallTOGASHI, AtsushiWIEBER, Gary
    • C08L83/04
    • C08L101/00C08G77/12C08G77/16C08G77/18C08G77/20C08G77/44C08G77/70C08L83/04C08L2666/14C08L2666/02
    • This invention relates to a flame retardant composition comprising: (a) 81 to 99.99 weight percent of a thermoplastic resin, thermoset resin, thermoplastic resin blend, or thermoset resin blend which upon burning forms a char and (b) 0.01-19 weight percent of a silsesquioxane resin having a weight average molecular weight of greater than 300 and having the average molecular formula: (R 3 SiO 1/2 ) a (R 2 SiO 2/2 ) b (RSiO 3/2 ) c (SiO 4 / 2 ) d (RO 1/2 ) e (OH 1/2 ) f wherein each R is hydrogen, an alkyl group, an alkenyl group, or an aryl group having from 6 to 12 carbon atoms, a and b are zero or positive numbers and the value of a+b is greater than zero, c is a positive number, d, e and f are zero or positive numbers with the provisos that the copolymer comprises at least 40 mole percent of RsiO 3/2 units, the copolymer comprises less than 10 mole percent SiO 4/2 units, greater than 30 mole percent of the silicon-bonded R groups are silicon-bonded aryl groups, greater than 0.5 mole percent of the silicon-bonded R groups are silicon-bonded hydrogen atoms, the content of silicon-bonded hydroxyl groups is equal to or less than 2 weight percent, and the content of silicon-bonded alkoxy groups where the alkoxy group is methoxy or ethoxy is equal to or less than 5 weight percent.
    • 本发明涉及一种阻燃剂组合物,其包含:(a)81至99.99重量%的热塑性树脂,热固性树脂,热塑性树脂共混物或热固树脂共混物,其在燃烧时形成炭,(b)0.01-19重量% 具有平均分子式为(R3SiO1 / 2)a(R2SiO2 / 2)b(RSiO3 / 2)c(SiO4 / 2)d(RO1 / 2)e的重均分子量大于300的倍半硅氧烷树脂 (OH1 / 2)f,其中每个R是氢,烷基,烯基或具有6至12个碳原子的芳基,a和b是零或正数,a + b的值大于 零,c是正数,d,e和f为零或正数,条件是共聚物包含至少40摩尔%的RsiO3 / 2单元,共聚物包含小于10摩尔%的SiO 4/2单元,更大 超过30摩尔%的与硅键合的R基团是硅键合的芳基,大于0.5摩尔%的硅键 硅键合氢原子的硅键合羟基的含量等于或小于2重量%,烷氧基为甲氧基或乙氧基的硅键合烷氧基的含量等于或等于 超过5重量%。