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1. 发明申请

WO2005013366A1 HEATSINKING ELECTRONIC DEVICES 审中-公开
标题翻译：加热电子设备
公开(公告)号：WO2005013366A1
公开(公告)日：2005-02-10
申请号：PCT/US2004/023438
申请日：2004-07-21
申请人： HONEYWELL INTERNATIONAL INC , NEWBY, Theodore, A.
发明人： NEWBY, Theodore, A.
IPC分类号： H01L25/13
CPC分类号： F21V29/004 , F21K9/00 , F21V29/763 , F21Y2105/10 , F21Y2115/10 , H01L2924/0002 , H05K1/021 , H05K1/182 , H05K3/0061 , H05K2201/10106 , H01L2924/00
摘要： Method and apparatus are provided for thermally coupling one or more electronic devices to a heatsink. The apparatus comprises a heatsink having a substantially planar upper surface, a wiring board (PWB) with a through-hole for receiving the device such that a principal face thereof is in thermal contact with the heatsink, its electrical leads are captured between at least a portion of the wiring board and the heatsink, and a top of the device protrudes through the PWB. The method comprises placing the device in the through-hole with its base exposed on and protruding from the underside of the PWB, attaching its electrical leads to contacts on the wiring board and pressing the PWB toward the heatsink with the leads captured there between. An electrically insulating thermally conducting layer is desirably placed between the wiring board and the heatsink.
摘要翻译：提供了用于将一个或多个电子装置热耦合到散热器的方法和装置。该装置包括具有基本平面的上表面的散热器，具有用于接收该装置的通孔的布线板（PWB），使得其主面与散热器热接触，其电引线至少被捕获在部分布线板和散热器，并且设备的顶部突出穿过PWB。该方法包括将设备放置在通孔中，其基座暴露在PWB的下侧并从PWB的下侧突出，将其电引线连接到接线板上的触点上，并将PWB朝向散热器与其间捕获的引线相压。电绝缘导热层优选放置在布线板和散热片之间。

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