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    • 8. 发明申请
    • CURABLE SOL-GEL COMPOSITION
    • 可固化溶胶凝胶组合物
    • WO2010127693A1
    • 2010-11-11
    • PCT/EP2009/055398
    • 2009-05-05
    • ABB Research LtdTZAVALAS, SpirosSINGH, BandeepKORNMANN, Xavier
    • TZAVALAS, SpirosSINGH, BandeepKORNMANN, Xavier
    • C08K3/34H01B3/40
    • H01B3/40
    • Curable sol-gel composition useful for modifying the surface of a conventional electrical insulation system and providing said surface with an improved tracking and erosion resistance, characterized in that said sol-gel composition comprises: (a) cyclo-aliphatic epoxy resin compound containing at least two 1,2-epoxy groups per molecule [component (a) ]; (b) a glycidoxypropane-tri (Ci-4) alkoxysilane [component (b) ]; (c) a gamma-aminopropyl-tri (C1-4) alkoxysilane [component (c) ]; (d) a mineral filler material [component (d) ]; and (e) a hydrophobic compound [component (e) ] or a mixture of such hydrophobic compounds being selected from the group comprising fluorinated or chlorinated hydrocarbons or organopolysiloxanes; wherein the ratio of the epoxy equivalents of component (a) to the epoxy equivalents of component (b) is from 9:1 to 6:4; the molar ratio of component (c) to the epoxy equivalents of the sum of [component (a) ] and [component (b) ] is from about 0.9 to 1.1; the mineral filler material [component (d) ] is present in a quatity of about 55% by weight to about 85% by weight, calculated to the total weight of the cured composition; the hydrophobic compound [component (e) ] is present in a quantity of about 1.0% by weight to about 10% by weight, calculated to the total weight of the cured composition; whereby the curable sol-gel composition optionally contains further additives; electrical insulation system comprising said cured composition.
    • 可溶性溶胶 - 凝胶组合物可用于改变常规电绝缘系统的表面并提供所述表面具有改善的耐追踪和耐侵蚀性,其特征在于所述溶胶 - 凝胶组合物包含:(a)至少含有至少 每个分子两个1,2-环氧基[组分(a)]; (b)缩水甘油氧基丙烷 - 三(C 1-4)烷氧基硅烷[组分(b)]; (c)γ-氨基丙基三(C 1-4)烷氧基硅烷[组分(c)]; (d)矿物填充材料[组分(d)]; 和(e)疏水化合物[组分(e)]或这些疏水化合物的混合物,其选自氟化或氯化烃或有机聚硅氧烷; 其中组分(a)的环氧当量与组分(b)的环氧当量的比例为9:1至6:4; 组分(c)与[组分(a)]和[组分(b)]之和的环氧当量的摩尔比为约0.9至1.1; 矿物填充材料[组分(d)]以固化组合物的总重量计,为约55重量%至约85重量%的量; 疏水性化合物[组分(e)]以固化组合物的总重量计为约1.0重量%至约10重量%的量存在; 由此可固化溶胶 - 凝胶组合物任选地含有其它添加剂; 电绝缘系统包括所述固化的组合物。
    • 10. 发明申请
    • ELECTRICAL INSULATION SYSTEM
    • 电绝缘系统
    • WO2011095208A1
    • 2011-08-11
    • PCT/EP2010/051298
    • 2010-02-03
    • ABB RESEARCH LTDKORNMANN, XavierSCHMIDT, Lars, E.KRIVDA, AndrejGREUTER, FelixCARLEN, Martin
    • KORNMANN, XavierSCHMIDT, Lars, E.KRIVDA, AndrejGREUTER, FelixCARLEN, Martin
    • H01B3/30H01B3/40C08K9/06
    • C08K3/22B82Y30/00C08K3/36H01B3/40Y10T428/2982
    • Electrical insulation system with improved electrical breakdown strength, said electrical insulation system comprising a hardened polymer component having incorporated therein a conventional filler material and a selected nano-scale sized filler material, wherein (a) said hardened polymer component is selected from epoxy resin compositions, polyesters, polyamides, polybutylene terephthalate, polyurethanes and polydicyclopentadiene, and preferably is a hardened epoxy resin system; (b) said conventional filler material is a known filler material having an average grain size distribution within the range of 1 μm-500 μm, being present in a quantity within the range of 40%-65% by weight, calculated to the total weight of the insulator system; and (c) said selected nano-scale sized silica powder is a pretreated nano-scale sized filler material, having been produced by a sol- gel process; wherein said selected nano-scale sized silica powder is present within the electrical insulation system in an amount of about l%-20% by weight, calculated to the weight of the conventional filler material present in the electrical insulator system; method of preparing said insulations; and electrical insulation system containing the components (a) and (c) only.
    • 具有改善的电击穿强度的电绝缘系统,所述电绝缘系统包括硬化的聚合物组分,其中掺入了常规的填充材料和选定的纳米尺寸的填充材料,其中(a)所述硬化的聚合物组分选自环氧树脂组合物, 聚酯,聚酰胺,聚对苯二甲酸丁二醇酯,聚氨酯和聚二环戊二烯,优选为硬化环氧树脂体系; (b)所述常规填充材料是已知的平均粒度分布在1μm〜500μm范围内的填充材料,其以总重量计算在40重量%-65重量%的范围内 的绝缘子系统; 和(c)所选择的纳米尺寸二氧化硅粉末是经溶胶 - 凝胶法生产的经预处理的纳米级填料; 其中所述选定的纳米尺寸二氧化硅粉末以约1%-20%(重量)的量存在于电绝缘系统内,其量计算为存在于电绝缘体系统中的常规填料材料的重量; 制备所述绝缘体的方法; 和包含组分(a)和(c)的电绝缘体系。