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    • 3. 发明申请
    • APPARATUS OF TRANSFERRING SEMICONDUCTOR PACKAGE
    • 传输半导体封装的设备
    • WO2008066335A1
    • 2008-06-05
    • PCT/KR2007/006091
    • 2007-11-29
    • INTEKPLUS CO., LTD.IM, Ssang-gunLEE, Sang-yunKO, Seung-gyuKANG, Sung-yong
    • IM, Ssang-gunLEE, Sang-yunKO, Seung-gyuKANG, Sung-yong
    • H01L21/68
    • H01L21/6838
    • Disclosed is an apparatus of transferring a semiconductor package in which includes a plurality of picker modules to pick up and invert the semiconductor package for the transfer of the semiconductor package. Each picker module includes a vertical bracket, a cylinder block attached to a lower end portion of the vertical bracket, a cylinder rod penetrated through the cylinder block and having a lower end inserted into a cylinder rod mount, to vertically move the cylinder rod mount by upward and downward movements thereof, and a picker penetrated through the cylinder block and integrally coupled with the cylinder rod mount, to be vertically moved according to the vertical movement of the cylinder rod mount, so as to pick up and rotate the semiconductor package. A rotating device is integrally mounted on the top of the cylinder block, to rotate the picker by operation of a motor.
    • 公开了一种转移半导体封装的装置,其中包括多个拾取器模块以拾取和反转用于半导体封装的传输的半导体封装。 每个拾取器模块包括一个垂直支架,一个连接到垂直支架下端部分的气缸体,一个穿过气缸体的气缸杆,其下端插入一个气缸杆安装座中,以使气缸杆安装座垂直移动 上下移动,以及穿过气缸体并与气缸杆安装件一体联接的拾取器,根据气缸杆座的垂直运动垂直移动,以便拾取和旋转半导体封装。 旋转装置一体地安装在气缸体的顶部上,以通过电动机的操作旋转拾取器。
    • 4. 发明申请
    • SEMICONDUCTOR PACKAGE INSPECTING SYSTEM
    • 半导体包装检测系统
    • WO2008143471A1
    • 2008-11-27
    • PCT/KR2008/002866
    • 2008-05-22
    • INTEKPLUS CO., LTDLIM, Ssang-gunLEE, Sang-yunCHOI, Ho-KeunKO, Seung-Gyu
    • LIM, Ssang-gunLEE, Sang-yunCHOI, Ho-KeunKO, Seung-Gyu
    • H01L21/66
    • B07C5/3422G01N21/95
    • A semiconductor package inspecting system includes a loading unit, a first vision inspection unit for visually inspecting a first surface of the semiconductor package, a second vision inspection unit for two-dimensionally inspecting a second surface of the semiconductor package using a color camera, a tray transfer device for transferring, a third vision inspection unit for two-dimensionally inspecting the second surface of the semiconductor package using a line scan camera, an unloading unit for allowing a tray having good-quality semiconductor devices received therein to be stacked therein, a fourth vision inspection unit for two-dimensionally inspecting the first surface of the semiconductor package using a line scan camera, a inverting device for transferring the tray, a reject unit for sorting and receiving defective semiconductor devices, and a sorting device for sorting the visually inspected semiconductor packages.
    • 半导体封装检查系统包括加载单元,用于目视检查半导体封装的第一表面的第一视觉检查单元,用于使用彩色相机二维地检查半导体封装的第二表面的第二视觉检查单元,托盘 用于传送的传送装置,用于使用线扫描照相机二维地检查半导体封装的第二表面的第三视觉检查单元,用于允许其中容纳有其中容纳有优质半导体器件的托盘堆叠在其中的卸载单元,第四 视线检查单元,用于使用线扫描照相机二维地检查半导体封装的第一表面,用于传送托盘的反转装置,用于分类和接收有缺陷的半导体器件的拒收单元,以及用于对目视检查的半导体进行分类的分类装置 包。