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    • 6. 发明申请
    • SURFACE POLISHING AGENT COMPRISING NANO SIZED TUNGSTEN CARBIDE POWDERS AND POLISHING METHODS USING THE SAME
    • 包含纳米尺寸碳纳米管粉末的表面抛光剂和使用其的抛光方法
    • WO2007037579A1
    • 2007-04-05
    • PCT/KR2006/000270
    • 2006-01-24
    • TPS INC.LEE, Won GunBAE, Young JeJUNG, Yong HwaCHO, Bum Rae
    • LEE, Won GunBAE, Young JeJUNG, Yong HwaCHO, Bum Rae
    • C09K3/14
    • C09K3/1463C03C19/00C09G1/02
    • Disclosed are a method of polishing a body or a substrate such as a wafer for use in optical and electrical parts, and a polishing agent used therefor. This invention provides a method of polishing a subject, including providing a polishing agent containing tungsten carbide powder and a lubricant onto a metal platen and polishing the subject with the polishing agent containing tungsten carbide powder while rotating the metal platen. According to this invention, a subject that is good with respect to both flatness and roughness can be provided while assuring a fast polishing time period. Particularly, a sapphire wafer having minimum faults and glass and synthetic quartz plates having high flatness can be provided. Further, the method of this invention can be applied to polishing s ingle- crystal wafers such as silicon wafers or lithium tantalate wafers.
    • 公开了一种抛光用于光学和电气部件的诸如晶片的主体或基板的方法,以及用于其的抛光剂。 本发明提供了一种抛光对象的方法,包括在金属压板上提供含有碳化钨粉末和润滑剂的抛光剂,并在旋转金属压板的同时用含有碳化钨粉末的抛光剂抛光对象。 根据本发明,可以在确保快速抛光时间的同时提供相对于平坦度和粗糙度均良好的被摄体。 特别地,可以提供具有最小断层的蓝宝石晶片和具有高平坦度的玻璃和合成石英板。 此外,本发明的方法可以应用于抛光单晶晶片,例如硅晶片或钽酸锂晶片。