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    • 2. 发明申请
    • APPARATUS OF TRANSFERRING SEMICONDUCTOR PACKAGE
    • 传输半导体封装的设备
    • WO2008066335A1
    • 2008-06-05
    • PCT/KR2007/006091
    • 2007-11-29
    • INTEKPLUS CO., LTD.IM, Ssang-gunLEE, Sang-yunKO, Seung-gyuKANG, Sung-yong
    • IM, Ssang-gunLEE, Sang-yunKO, Seung-gyuKANG, Sung-yong
    • H01L21/68
    • H01L21/6838
    • Disclosed is an apparatus of transferring a semiconductor package in which includes a plurality of picker modules to pick up and invert the semiconductor package for the transfer of the semiconductor package. Each picker module includes a vertical bracket, a cylinder block attached to a lower end portion of the vertical bracket, a cylinder rod penetrated through the cylinder block and having a lower end inserted into a cylinder rod mount, to vertically move the cylinder rod mount by upward and downward movements thereof, and a picker penetrated through the cylinder block and integrally coupled with the cylinder rod mount, to be vertically moved according to the vertical movement of the cylinder rod mount, so as to pick up and rotate the semiconductor package. A rotating device is integrally mounted on the top of the cylinder block, to rotate the picker by operation of a motor.
    • 公开了一种转移半导体封装的装置,其中包括多个拾取器模块以拾取和反转用于半导体封装的传输的半导体封装。 每个拾取器模块包括一个垂直支架,一个连接到垂直支架下端部分的气缸体,一个穿过气缸体的气缸杆,其下端插入一个气缸杆安装座中,以使气缸杆安装座垂直移动 上下移动,以及穿过气缸体并与气缸杆安装件一体联接的拾取器,根据气缸杆座的垂直运动垂直移动,以便拾取和旋转半导体封装。 旋转装置一体地安装在气缸体的顶部上,以通过电动机的操作旋转拾取器。
    • 3. 发明申请
    • SURFACE SHAPE MEASURING SYSTEM AND SURFACE SHAPE MEASURING METHOD USING THE SAME
    • 表面形状测量系统和表面形状测量方法
    • WO2009078617A3
    • 2009-08-13
    • PCT/KR2008007314
    • 2008-12-10
    • INTEKPLUS CO LTDLEE SANG-YUNKANG MINGULIM SSANG-GUN
    • LEE SANG-YUNKANG MINGULIM SSANG-GUN
    • G01B11/24
    • G01B11/2441
    • The surface shape measuring system includes an illumination unit including a main light source, a focusing lens, and a projection lens; a beam splitter to split illumination light emitted respectively irradiated onto a reference surface and a measurement surface; a light detecting element to capture an interference pattern; and a control computer to obtain surface shape data through white-light interference pattern analysis from an image captured and detect whether or not the measurement surface is defective from the obtained data, wherein a subsidiary light source to provide falling illumination to the target object; and two-dimensional data and three-dimensional data regarding the surface shape of the target object are obtained by selectively intermitting the turning-on of the main light source and the subsidiary light source and the irradiation of the illumination light onto the reference surface.
    • 所述表面形状测量系统包括:包括主光源,聚焦透镜和投影透镜的照明单元; 分光器,用于将分别照射到参考表面和测量表面上的照射光分离; 用于捕获干涉图案的光检测元件; 以及控制计算机,通过从所拍摄的图像通过白光干涉图案分析获得表面形状数据,并从所获得的数据检测测量表面是否有缺陷,其中辅助光源向目标物体提供落下的照明; 并且通过选择性地将主光源和辅助光源的接通以及照射光照射到参考表面上来获得关于目标物体的表面形状的二维数据和三维数据。
    • 4. 发明申请
    • THREE-DIMENSIONAL SHAPE MEASURING APPARATUS
    • 三维形状测量装置
    • WO2009078616A3
    • 2009-08-13
    • PCT/KR2008007313
    • 2008-12-10
    • INTEKPLUS CO LTDYOU JOON-HOKANG MINGULIM SSANG-GUN
    • YOU JOON-HOKANG MINGULIM SSANG-GUN
    • G01B11/24
    • G01B11/2441G01B9/02028G01B2290/35
    • The three-dimensional shape measuring apparatus includes a light source; a beam splitter to split illumination light from the light source; a target object to be measured, having a height difference between the highest point and the lowest point; a reference mirror, on which another beam emitted from the beam splitter is irradiated; a light detecting element to detect an interference pattern generated by the interference of an object beam reflected by the surface of the target object and a reference beam reflected by the surface of the reference mirror; and a control computer to process an image detected by the light detecting element, wherein a subsidiary reference beam generating unit to change the optical path of the beam from the beam splitter to generate a subsidiary reference beam is provided between the beam splitter and the reference mirror.
    • 三维形状测量装置包括光源; 分束器,用于分离来自光源的照明光; 要测量的目标对象,具有最高点和最低点之间的高度差; 参考镜,在其上照射从分束器发射的另一个光束; 光检测元件,用于检测由目标物体的表面反射的物体光束的干涉产生的干涉图案和由参考反射镜的表面反射的参考光束; 以及控制计算机,用于处理由光检测元件检测到的图像,其中,在分束器和参考镜之间设置有用于改变来自分束器的光束的光路以产生辅助参考光束的辅助参考光束产生单元 。
    • 6. 发明申请
    • VISION INSPECTION SYSTEM FOR SEMICONDUCTOR DEVICES
    • 半导体器件视觉检测系统
    • WO2009005222A1
    • 2009-01-08
    • PCT/KR2008/003100
    • 2008-06-03
    • INTEKPLUS CO., LTDLIM, Ssang-gunLEE, Sang-yunSON, Dong-KyuJANG, Sung-MinAN, Ju-Hun
    • LIM, Ssang-gunLEE, Sang-yunSON, Dong-KyuJANG, Sung-MinAN, Ju-Hun
    • H01L21/66
    • G01N35/04
    • A vision inspection system for semiconductor devices includes a pair of loaders, respectively, each loader being constructed to allow a plurality of magazines, on each of which a tray having a plurality of semiconductor devices received therein is loaded, to be staked therein, the magazines being movable upward or downward, a pair of indexers disposed at the rear of the respective loaders for transferring trays to a sorting region and a vision inspection region, a vision inspection unit, a transfer picker for picking up and transferring semiconductor devices to be visually inspected, and a sorting unit for sorting the visually inspected semiconductor devices. Each magazine includes a magazine body, and a tray alignment unit disposed at one side of the magazine body, for aligning the tray loaded on the magazine body depending upon the size of the tray.
    • 半导体器件的视觉检查系统分别包括一对装载器,每个装载器被构造成允许在其中装载有多个半导体装置的托盘中的每一个的多个杂志被放置在其中,所述杂志 可向上或向下移动的一对分度器,设置在相应装载机后部的一对分度器,用于将托盘传送到分拣区域和视觉检查区域,视觉检查单元,用于拾取和传送待视觉检查的半导体器件的传送拾取器 以及用于对目视检查的半导体器件进行分类的分类单元。 每个杂志盒包括一个杂志主体和一个设置在杂志主体一侧的托盘对齐单元,用于根据托盘的尺寸对准装载在盒体上的托盘。
    • 7. 发明申请
    • APPARATUS FOR AND METHOD OF MEASURING IMAGE
    • 测量图像的方法和方法
    • WO2007046626A1
    • 2007-04-26
    • PCT/KR2006/004225
    • 2006-10-18
    • INTEKPLUS CO., LTD.LEE, Sang-YoonKANG, Min-GuLIM, Ssang-Gun
    • LEE, Sang-YoonKANG, Min-GuLIM, Ssang-Gun
    • G01B11/24
    • G01B9/04
    • An image measuring apparatus for enhancing an accuracy of an image captured by an optical system and a method thereof are disclosed. The apparatus includes a CCD camera for capturing the object and outputting the captured image, a lamp for generating white light to illuminate a capturing area of the object, an illumination controller for controlling the lamp to be turned on, a piezoelectric actuator for controlling a minute height of the optical system with respect to the object, an image capturing device for acquiring the image captured by the CCD camera, a driving signal generator for outputting a driving signal to the illumination controller and the piezoelectric actuator when an enable signal is generated from the CCD camera, and an image signal processor for estimating height information of the object from data transmitted from the image capturing unit.
    • 公开了一种用于提高由光学系统捕获的图像的精度的图像测量装置及其方法。 该装置包括用于捕获物体并输出拍摄图像的CCD照相机,用于产生白光以照亮被摄体的拍摄区域的灯,用于控制被导通的灯的照明控制器,用于控制分钟的压电致动器 相对于物体的光学系统的高度,用于获取由CCD照相机拍摄的图像的图像捕获装置,当从该照相机产生使能信号时,将驱动信号输出到照明控制器和压电致动器的驱动信号发生器 CCD摄像机,以及图像信号处理器,用于根据从图像拍摄单元发送的数据来估计物体的高度信息。
    • 9. 发明申请
    • THREE-DIMENSIONAL SHAPE MEASURING APPARATUS
    • 三维形状测量仪器
    • WO2009078616A4
    • 2009-10-08
    • PCT/KR2008007313
    • 2008-12-10
    • INTEKPLUS CO LTDYOU JOON-HOKANG MINGULIM SSANG-GUN
    • YOU JOON-HOKANG MINGULIM SSANG-GUN
    • G01B11/24
    • G01B11/2441G01B9/02028G01B2290/35
    • The three-dimensional shape measuring apparatus includes a light source; a beam splitter to split illumination light from the light source; a target object to be measured, having a height difference between the highest point and the lowest point; a reference mirror, on which another beam emitted from the beam splitter is irradiated; a light detecting element to detect an interference pattern generated by the interference of an object beam reflected by the surface of the target object and a reference beam reflected by the surface of the reference mirror; and a control computer to process an image detected by the light detecting element, wherein a subsidiary reference beam generating unit to change the optical path of the beam from the beam splitter to generate a subsidiary reference beam is provided between the beam splitter and the reference mirror.
    • 该三维形状测量装置包括光源; 分束器,用于分离来自光源的照明光; 要测量的目标物体,其在最高点和最低点之间具有高度差; 参考反射镜,其上照射从分束器发射的另一个光束; 光检测元件,用于检测由所述目标物体的表面反射的物体光束与由所述参考反射镜的表面反射的参考光束的干涉而产生的干涉图案; 以及控制计算机,用于处理由光检测元件检测到的图像,其中,在分束器和参考镜之间设置辅助参考光束产生单元,用于改变来自分束器的光束的光路以产生辅助参考光束 。
    • 10. 发明申请
    • THREE-DIMENSIONAL SHAPE MEASURING APPARATUS
    • 三维形状测量仪器
    • WO2009078616A2
    • 2009-06-25
    • PCT/KR2008/007313
    • 2008-12-10
    • INTEKPLUS CO., LTDYOU, Joon-HoKANG, MinGuLIM, Ssang-gun
    • YOU, Joon-HoKANG, MinGuLIM, Ssang-gun
    • G01B11/24
    • G01B11/2441G01B9/02028G01B2290/35
    • The three-dimensional shape measuring apparatus includes a light source; a beam splitter to split illumination light from the light source; a target object to be measured, having a height difference between the highest point and the lowest point; a reference mirror, on which another beam emitted from the beam splitter is irradiated; a light detecting element to detect an interference pattern generated by the interference of an object beam reflected by the surface of the target object and a reference beam reflected by the surface of the reference mirror; and a control computer to process an image detected by the light detecting element, wherein a subsidiary reference beam generating unit to change the optical path of the beam from the beam splitter to generate a subsidiary reference beam is provided between the beam splitter and the reference mirror.
    • 该三维形状测量装置包括光源; 分束器,用于分离来自光源的照明光; 要测量的目标物体,其在最高点和最低点之间具有高度差; 参考反射镜,其上照射从分束器发射的另一个光束; 光检测元件,用于检测由所述目标物体的表面反射的物体光束与由所述参考反射镜的表面反射的参考光束的干涉而产生的干涉图案; 以及控制计算机,用于处理由光检测元件检测到的图像,其中,在分束器和参考镜之间设置辅助参考光束产生单元,用于改变来自分束器的光束的光路以产生辅助参考光束