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1. 发明申请

WO2011063084A2 ELECTROSTATIC CHUCK WITH REDUCED ARCING 审中-公开
标题翻译：具有减少弧光的静电卡盘
公开(公告)号：WO2011063084A2
公开(公告)日：2011-05-26
申请号：PCT/US2010/057170
申请日：2010-11-18
申请人： APPLIED MATERIALS, INC. , WILLWERTH, Michael D. , PALAGASHVILI, David , BUCHBERGER, JR., Douglas A. , CHAFIN, Michael G.
发明人： WILLWERTH, Michael D. , PALAGASHVILI, David , BUCHBERGER, JR., Douglas A. , CHAFIN, Michael G.
IPC分类号： H01L21/687 , B23Q3/15 , H02N13/00
CPC分类号： H01L21/6833 , Y10T279/23
摘要： Embodiments of electrostatic chucks are provided herein. In some embodiments, an electrostatic chuck may include a body having a notched upper peripheral edge, defined by a first surface perpendicular to a body sidewall and a stepped second surface disposed between the first surface and a body upper surface, and a plurality of holes disposed through the body along the first surface; a plurality of fasteners disposed through the plurality of holes to couple the body to a base disposed beneath the body; a dielectric member disposed above the body upper surface to electrostatically retain a substrate; an insulator ring disposed about the body within the notched upper peripheral edge and having a stepped inner sidewall that mates with the stepped second surface to define a non-linear interface therebetween; and an edge ring disposed over the insulator ring, the non-linear interface limiting arcing between the edge ring and the fastener.
摘要翻译：本文提供了静电卡盘的实施例。在一些实施例中，静电吸盘可以包括具有切口的上周边边缘的主体，该顶部边缘由垂直于主体侧壁的第一表面和设置在第一表面和主体上表面之间的阶梯状第二表面限定，沿着第一面穿过身体; 多个紧固件，其布置成穿过所述多个孔，以将所述主体连接到设置在所述主体下方的底座; 设置在所述主体上表面上方的电介质部件，以静电保持基板; 绝缘体环，其围绕所述主体设置在所述凹口的上周边边缘内并且具有与所述阶梯状的第二表面配合的阶梯状的内侧壁，以在其间限定非线性界面; 以及设置在所述绝缘体环上的边缘环，所述非线性界面限制所述边缘环和所述紧固件之间的电弧。

2. 发明申请

WO2011063084A3 ELECTROSTATIC CHUCK WITH REDUCED ARCING 审中-公开
标题翻译：静电夹具减少弧线
公开(公告)号：WO2011063084A3
公开(公告)日：2011-11-17
申请号：PCT/US2010057170
申请日：2010-11-18
申请人： APPLIED MATERIALS INC , WILLWERTH MICHAEL D , PALAGASHVILI DAVID , BUCHBERGER JR DOUGLAS A , CHAFIN MICHAEL G
发明人： WILLWERTH MICHAEL D , PALAGASHVILI DAVID , BUCHBERGER JR DOUGLAS A , CHAFIN MICHAEL G
IPC分类号： H01L21/687 , B23Q3/15 , H02N13/00
CPC分类号： H01L21/6833 , Y10T279/23
摘要： Embodiments of electrostatic chucks are provided herein. In some embodiments, an electrostatic chuck may include a body having a notched upper peripheral edge, defined by a first surface perpendicular to a body sidewall and a stepped second surface disposed between the first surface and a body upper surface, and a plurality of holes disposed through the body along the first surface; a plurality of fasteners disposed through the plurality of holes to couple the body to a base disposed beneath the body; a dielectric member disposed above the body upper surface to electrostatically retain a substrate; an insulator ring disposed about the body within the notched upper peripheral edge and having a stepped inner sidewall that mates with the stepped second surface to define a non-linear interface therebetween; and an edge ring disposed over the insulator ring, the non-linear interface limiting arcing between the edge ring and the fastener.
摘要翻译：本文提供了静电卡盘的实施例。在一些实施例中，静电卡盘可以包括具有凹口上部周边边缘的主体，该边缘由垂直于主体侧壁的第一表面和设置在第一表面和主体上表面之间的阶梯式第二表面限定，并且多个孔布置通过身体沿着第一面; 多个紧固件，穿过所述多个孔设置以将所述主体联接到设置在所述主体下方的基座; 电介质构件，所述电介质构件设置在所述主体上表面上方以静电地保持基板; 绝缘体环，所述绝缘体环围绕所述主体设置在所述带凹口的上外围边缘内并且具有与所述台阶式第二表面配合以在其间限定非线性界面的阶梯式内侧壁; 以及设置在绝缘环上的边缘环，非线性接口限制边缘环和紧固件之间的电弧。

3. 发明申请

WO2013162643A1 PLASMA REACTOR ELECTROSTATIC CHUCK WITH COOLED PROCESS RING AND HEATED WORKPIECE SUPPORT SURFACE 审中-公开
标题翻译：具有冷却工艺环和加热工件支撑表面的等离子体反应器静电卡
公开(公告)号：WO2013162643A1
公开(公告)日：2013-10-31
申请号：PCT/US2012/060195
申请日：2012-10-15
申请人： APPLIED MATERIALS, INC. , WILLWERTH, Michael, D. , PALAGASHVILI, David , CHAFIN, Michael, G. , LIN, Ying-sheng
发明人： WILLWERTH, Michael, D. , PALAGASHVILI, David , CHAFIN, Michael, G. , LIN, Ying-sheng
IPC分类号： H01L21/3065 , H01L21/687
CPC分类号： H01J37/321 , H01J37/32642 , H01J37/32715 , H01J37/32724
摘要： Undesirable heating of a semiconductor process ring is prevented by thermally isolating the process ring from the insulating pack of an electrostatic chuck, and providing a thermally conductive and electrically insulating thermal ring contacting both the semiconductor process ring and an underlying metal base having internal coolant flow passages.
摘要翻译：通过将工艺环与静电卡盘的绝缘包热隔离，并且提供接触半导体工艺环和下面的金属底座的导热和电绝缘的热环来防止半导体工艺环的不期望的加热，其具有内部冷却剂流动通道。

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