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    • 81. 发明申请
    • CIRCULAR STRIPLINE PACKAGE INCORPORATING A LOW NOISE AMPLIFIER
    • 包含低噪声放大器的圆形条带包装
    • WO98042170A1
    • 1998-09-24
    • PCT/US1998/004921
    • 1998-03-12
    • H05K9/00F42B15/01H01L20060101H01P5/08H03F3/00H03F3/19H03F3/60H04B1/10H05K20060101H05K5/00
    • H01L23/66H01L2223/6644H01L2924/0002H01L2924/00
    • A circular low noise amplifier package (10) having an X-band MMIC low noise amplifier (16) disposed therein, that may be preferably used with an existing stripline receiver board (11) employed in a missile. The package (10) has three input/output ports symmetrically located around the package (10), including DC bias, RF input, and RF output ports. The package (10) mounts directly into the stripline receiver board (11) as a drop-in replacement for an isolator used in the existing stripline receiver board (11). The circular low noise amplifier package (10) having a top cover (12), an upper RF gasket (13), a package lid (14), a hermetic low noise amplifier module (15) containing a low noise amplifier chip (16), a lower RF gasket (17), and a bottom cover (18). The amplifier module (15) has feedthrough pins (21) that extend through the outer wall thereof and couple to the low noise amplifier chip (16). The top and bottom covers (12, 18) are used to secure the amplifier package (10) to the stripline receiver board (11). The upper and lower RF gaskets (13, 17) aid in improving an RF ground. The package lid (14) is seam sealed to the amplifier module (15) to hermetically seal the entire package (10).
    • 具有设置在其中的X波段MMIC低噪声放大器(16)的圆形低噪声放大器封装(10),其可优选地与在导弹中使用的现有带状线接收板(11)一起使用。 封装(10)具有对称地位于封装(10)周围的三个输入/输出端口,包括DC偏置,RF输入和RF输出端口。 封装(10)直接安装在带状线接收板(11)中,作为现有带状线接收器板(11)中使用的隔离器的替换。 具有顶盖(12),上RF垫片(13),封装盖(14),包含低噪声放大器芯片(16)的封闭式低噪声放大器模块(15)的圆形低噪声放大器封装(10) ,下部RF垫片(17)和底盖(18)。 放大器模块(15)具有穿过其外壁延伸并耦合到低噪声放大器芯片(16)的馈通引脚(21)。 顶盖和底盖(12,18)用于将放大器封装(10)固定到带状线接收器板(11)。 上下RF垫片(13,17)有助于改善RF接地。 包装盖(14)被接缝密封到放大器模块(15)以气密地密封整个包装(10)。