会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 71. 发明申请
    • A METHOD FOR MAKING A METAL-INSULATOR-METAL CAPACITOR USING PLATE-THROUGH MASK TECHNIQUES
    • 使用板穿透掩模技术制造金属绝缘体金属电容器的方法
    • WO2002086947A2
    • 2002-10-31
    • PCT/US2002/010893
    • 2002-04-08
    • INFINEON TECHNOLOGIES NORTH AMERICA CORP.INTERNATIONAL BUSINESS MACHINES CORPORATION
    • WONG, Kwong, H.NING, Xian, J.
    • H01L
    • H01L28/60H01L21/3212H01L21/76838H01L28/75
    • A method for making a metal-insulator-metal capacitive structure includes depositing a copper barrier and seed layer over a support structure such as an inter-level dielectric layer, forming a dielectric over the copper barrier and seed layer, and then forming a forming a metal layer over the dielectric. The copper barrier and seed layer forms a bottom plate of a capacitor, and the metal layer forms the upper plate which is separated from the bottom plate by the dielectric. By forming the bottom plate from a copper barrier and seed layer, reduced sheet resistance and surface roughness is achieved, both of which enhance the performance of the capacitor. This performance is further enhanced by forming the capacitor to have a damascene structure. Preferably, at least one conductive interconnect is formed simultaneously with the formation of the capacitor. This is made possible, at least in part, by forming the interconnect using a plate-through mask technique. The interconnect and capacitor are then finished using one and only one planarizing (e.g., CMP) step. The result is to form a capacitor and interconnect structure in far fewer steps than conventionally required, which translates into improved cost and efficiency.
    • 制造金属 - 绝缘体 - 金属电容结构的方法包括在诸如层间电介质层的支撑结构上沉积铜屏障和种子层,在铜屏障和籽晶层上形成电介质,然后形成 电介质上的金属层。 铜屏障和种子层形成电容器的底板,并且金属层形成通过电介质与底板分离的上板。 通过从铜屏障和种子层形成底板,实现了降低的薄层电阻和表面粗糙度,这两者都增强了电容器的性能。 通过形成具有镶嵌结构的电容器来进一步增强该性能。 优选地,与电容器的形成同时形成至少一个导电互连。 至少部分地通过使用平板穿透技术形成互连来实现这一点。 然后使用一个且仅一个平面化(例如CMP)步骤来完成互连和电容器。 其结果是形成电容器和互连结构,其步骤远低于常规要求,这转化为成本和效率的提高。