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    • 71. 发明申请
    • PRODUCTION METHOD OF COMPOUND SEMICONDUCTOR DEVICE WAFER
    • 复合半导体器件的生产方法
    • WO2005122223A1
    • 2005-12-22
    • PCT/JP2005/010904
    • 2005-06-08
    • SHOWA DENKO K.K.KUSUNOKI, Katsuki
    • KUSUNOKI, Katsuki
    • H01L21/301
    • H01L33/0095B23K26/364
    • An object of the present invention is to provide a method for producing a compound semiconductor device wafer, which method enables cleaving of a wafer with precision and at remarkably high yield, attains high process speed, and improves productivity. The inventive method for producing a compound semiconductor device wafer, the wafer including a substrate and a plurality of compound semiconductor devices provided on the substrate and arranged with separation zones being disposed between the compound semiconductor devices, comprises a step of forming separation grooves, through laser processing, on the top surface of the substrate (i.e., surface on the compound semiconductor side) at the separation zones under the condition that a compound semiconductor layer is present on the top surface of the substrate.
    • 本发明的目的是提供一种化合物半导体器件晶片的制造方法,该方法能够精确地并且以高产率切割晶片,达到高处理速度,并提高生产率。 本发明的化合物半导体器件晶片的制造方法,包括基板的晶片和设置在基板上并配置有分离区域的多个化合物半导体器件,配置在化合物半导体器件之间,包括通过激光器形成分离槽的步骤 在化合物半导体层存在于基板的顶面的条件下,在分离区的基板的顶面(即,化合物半导体侧的表面)上进行加工。
    • 78. 发明申请
    • COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE
    • 化合物半导体发光器件
    • WO2005106980A1
    • 2005-11-10
    • PCT/JP2005/008459
    • 2005-04-27
    • SHOWA DENKO K.K.UDAGAWA, Takashi
    • UDAGAWA, Takashi
    • H01L33/00
    • H01L33/32H01L33/02H01L33/16H01L33/38
    • This pn-junction compound semiconductor light-emitting device includes a crystal substrate; an n-type light-emitting layer formed of a hexagonal n-type Group III nitride semiconductor and provided on the crystal substrate; a p-type Group III nitride semiconductor layer formed of a hexagonal p-type Group III nitride semiconductor and provided on the n-type light-emitting layer; a p-type boron-phosphide-based semiconductor layer having a sphalerite crystal type and provided on the p-type Group III nitride semiconductor layer; and a thin-film layer composed of an undoped hexagonal Group III nitride semiconductor formed on the p-type Group III nitride semiconductor layer, wherein the p-type boron-phosphide-based semiconductor layer is joined to the thin-film layer composed of an undoped hexagonal Group III nitride semiconductor.
    • 该pn结化合物半导体发光器件包括晶体衬底; 由六边形n型III族氮化物半导体形成的n型发光层,设置在该晶体基板上; 设置在n型发光层上的由六边形p型III族氮化物半导体形成的p型III族氮化物半导体层; 设置在p型III族氮化物半导体层上的具有闪锌矿型晶体的p型磷化硼类半导体层; 以及由在p型III族氮化物半导体层上形成的未掺杂的六方晶III族氮化物半导体构成的薄膜层,其中p型磷化硼类半导体层与由 未掺杂的六方晶III族氮化物半导体。