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    • 73. 发明申请
    • MAGNETRON SPUTTERING SYSTEMS INCLUDING ANODIC GAS DISTRIBUTION SYSTEMS
    • MAGNETRON喷射系统,包括阳极气体分配系统
    • WO2004061153A2
    • 2004-07-22
    • PCT/US2003/039433
    • 2003-12-11
    • CARDINAL CG COMPANYHARTIG, Klaus
    • HARTIG, Klaus
    • C23C14/34
    • H01J37/3244C23C14/35C23C14/56H01J37/3408
    • The present invention provides a megnetron sputtering system using a gas distribution system which also serves as a source of anodic charge to generate plasma field. The sputtering system is comprised of a vacuum chamber, a cathode target of sputterable material, a power source which supplies positive and negative charge, and a gas distribution system. The gas distribution system may comprise a simple perforated gas delivery member, or it may comprise a perforated gas delivery member with an attached conductive anodic surface. The gas delivery member may also contain an inner conduit with further perforations which serves to baffle flow of the sputtering gas. Gas flow may be regulated within discrete portions of the gas distribution system. The anodic surfaces of the gas distribution system are cleaned through the action of plasma and gas flow, creating a more stable plasma and reducing the need for maintenance.
    • 本发明提供了一种使用也用作阳极电荷源以产生等离子体场的气体分配系统的巨电子轰击系统​​。 溅射系统包括真空室,可溅射材料的阴极靶,供给正电荷和负电荷的电源以及气体分配系统。 气体分配系统可以包括简单的穿孔气体输送构件,或者其可以包括具有附接的导电阳极表面的穿孔气体输送构件。 气体输送构件还可以包含具有进一步穿孔的内部管道,其用于阻挡溅射气体的流动。 可以在气体分配系统的离散部分内调节气流。 气体分配系统的阳极表面通过等离子体和气体流动的作用被清除,产生更稳定的等离子体并减少维护的需要。
    • 75. 发明申请
    • EDGE TREATMENTS FOR COATED SUBSTRATES
    • 涂层基材的边缘处理
    • WO2002062716A1
    • 2002-08-15
    • PCT/US2002/003704
    • 2002-02-08
    • CARDINAL CG COMPANYHARTIG, KlausO'SHAUGHNESSY, Roger
    • HARTIG, KlausO'SHAUGHNESSY, Roger
    • C03C17/00
    • C03C17/366B24B7/17B24B7/242B24B7/26B24B9/102C03C17/00C03C17/002C03C17/256C03C17/3417C03C17/36C03C19/00C03C2217/71C03C2217/78C03C2218/328C03C2218/365E06B3/5427E06B3/56E06B3/6621E06B3/66342E06B3/6715
    • The invention provides a substrate (e.g., a glass pane) having generally opposed first and second major surfaces. At least one of these major surfaces bears a functional coating and has a peripheral region that is substantially free of the funcitonal coating. Another embodiment provides a multiple-pane insulating galss unit comprising two spaced-apart panes and a spacer joining confronting, inner peripheral surfaces of the panes. At least on of the panes has a coated outer surface. the coated outer surface has a peripheral region that is substantially free of the coating. The invention also provides methods for treating a coated substrate that has generally opposed first and second major surfaces each bearing a functional coating. The coating is substantially removed from a peripheral region of the first major surface. Likewise, the coating is substantially removed from a peripheral region of the secon major surface. A further embodiment provides a barrier layer that prevents cotact between glazing compound and an exterior coating. Durable compounds are provided in yet another embodiment.
    • 本发明提供了具有大致相对的第一和第二主表面的基底(例如,玻璃窗)。 这些主表面中的至少一个具有功能性涂层,并且具有基本上没有功能涂层的周边区域。 另一实施例提供了一种多窗格绝缘板,其包括两个间隔开的窗格和连接窗格的相对的内周表面的间隔件。 至少在窗格上有一个涂层的外表面。 涂覆的外表面具有基本上没有涂层的周边区域。 本发明还提供了一种用于处理涂覆的基材的方法,该基材具有大致相对的第一和第二主表面,每个主表面均具有功能性涂层。 涂层基本上从第一主表面的周边区域去除。 同样地,涂层基本上从第二主表面的周边区域除去。 另一实施例提供了防止玻璃化合物和外部涂层之间的共同作用的阻挡层。 在另一个实施方案中提供耐久化合物。
    • 80. 发明申请
    • METHOD OF COATING BOTH SIDES OF A SUBSTRATE
    • 涂布基材两面的方法
    • WO2017100118A1
    • 2017-06-15
    • PCT/US2016/064905
    • 2016-12-05
    • CARDINAL CG COMPANY
    • MYLI, Kari B.PFAFF, Gary L.BURROWS, Keith JamesSCHWEISS, Dylan
    • C23C14/56C03C17/00
    • C23C14/568C03C17/00C23C14/0676C23C14/086C23C14/35C23C14/564
    • A method of depositing coating onto both sides of a substrate comprising the sequential steps of -providing a substrate having a first surface and a second surface, -providing a production line comprising a series of sputtering chambers and a plurality of transport rollers for conveying the substrate along the production line, the series of sputtering chambers comprising one or more upper targets positioned above the plurality of transport rollers and one or more lower targets positioned beneath the plurality of transport rollers, -positioning the substrate on the production line such that the first surface is oriented toward said one or more upper targets and the second surface contacts two or more of the plurality of transport rollers, -upwardly sputtering said one or more lower targets to deposit a sacrificial coating onto the second surface and downwardly sputtering said one or more upper targets to deposit a first functional coating onto the first surface, -positioning the substrate on the production line such that the second surface is oriented toward said one or more upper targets and the first surface contacts two or more of the plurality of transport rollers, -removing the sacrificial coating from the second surface while leaving intact the first functional coating on the first surface and -downwardly sputtering said one or more upper targets to deposit a second functional coating onto the second surface.
    • 一种将涂层沉积到基材两面的方法,包括以下顺序步骤 - 提供具有第一表面和第二表面的基材, - 提供包括一系列溅射室和一系列溅射室的生产线, 用于沿着生产线输送基板的多个输送辊,所述一系列溅射室包括位于所述多个输送辊上方的一个或多个上部靶和位于所述多个输送辊下方的一个或多个下部靶,将基板定位在 所述生产线使得所述第一表面朝向所述一个或多个上部靶材并且所述第二表面接触所述多个传送辊中的两个或更多个, - 向上地溅射所述一个或多个下部靶材以将牺牲涂层沉积到所述第二表面上 并向下溅射所述一个或多个上部靶材以将第一功能涂层沉积到第一表面上 将生产线上的基板移动到使得第二表面朝向所述一个或多个上部靶材并且第一表面接触多个传送辊中的两个或更多个, - 从第二表面移除牺牲涂层,同时保持第一表面 在第一表面上进行多功能涂层,并且 - 向下溅射所述一个或多个上部靶材以在第二表面上沉积第二功能涂层。